H01B13/32

METHOD OF EXPOSING A GLASS-COATED MICROWIRE AND USES THEREOF

A method for exposing a microwire from it glass coating in a glass coated microwire. The method for exposing the microwire is facilitated by way of sufficiently bending the glass coated microwire to break the glass coating while maintaining the embedded microwire intact.

METHOD OF EXPOSING A GLASS-COATED MICROWIRE AND USES THEREOF

A method for exposing a microwire from it glass coating in a glass coated microwire. The method for exposing the microwire is facilitated by way of sufficiently bending the glass coated microwire to break the glass coating while maintaining the embedded microwire intact.

Multiscale all-soft electronic devices and circuits based on liquid metal

In a method making a flexible electrical conductor, a mask layer (216) is applied to a substrate (210). A portion of the mask layer (216) is removed to expose the substrate (210) in an exposed shape (220) corresponding to the conductor. A liquid phase conductor (232) is applied to the portion of the substrate (210). The mask layer (216) is dissolved with a solvent (238) to leave a shaped liquid phase conductor (234) corresponding to the exposed shape on the substrate (210). A primary elastomer layer (240) is applied onto the substrate (210) and the shaped liquid phase conductor (234). The primary elastomer layer (240) and the shaped liquid phase conductor (234) are removed from the substrate (210). A secondary elastomer layer (242) is applied to the shaped liquid phase conductor (234) and the primary elastomer layer (240) to seal the shaped liquid phase conductor (234) therein.

MANUFACTURING METHOD OF ELECTRONIC DEVICE
20220200652 · 2022-06-23 · ·

The disclosure provides a manufacturing method of an electronic device. The manufacturing method of the electronic device includes steps as follows. A substrate is provided. A first opening is formed and penetrates the substrate. A polymer layer is formed in the first opening. The polymer layer is in contact with a sidewall of the substrate at the first opening.

MANUFACTURING METHOD OF ELECTRONIC DEVICE
20220200652 · 2022-06-23 · ·

The disclosure provides a manufacturing method of an electronic device. The manufacturing method of the electronic device includes steps as follows. A substrate is provided. A first opening is formed and penetrates the substrate. A polymer layer is formed in the first opening. The polymer layer is in contact with a sidewall of the substrate at the first opening.

Production method for insulated electric wire and insulated electric wire

An insulated electric wire includes a conductor of a plurality of twisted elemental wires made of a conductive material, and an insulation covering. The wire includes an exposed portion in which the insulation covering is removed, and a covered portion in which the insulation covering covers the conductor. The exposed portion and the covered portion are adjacent with each other along a longitudinal axis of the wire. The covered portion includes an adjacent area located adjacent to the exposed portion, and a remote area located adjacent to the adjacent area and apart from the exposed portion. A density of the conductive material per unit length is higher in the exposed portion than in the remote area. The elemental wires are twisted in both the exposed portion and the remote area. Gaps between the elemental wires of the exposed portion are filled with a sealant.

Production method for insulated electric wire and insulated electric wire

An insulated electric wire includes a conductor of a plurality of twisted elemental wires made of a conductive material, and an insulation covering. The wire includes an exposed portion in which the insulation covering is removed, and a covered portion in which the insulation covering covers the conductor. The exposed portion and the covered portion are adjacent with each other along a longitudinal axis of the wire. The covered portion includes an adjacent area located adjacent to the exposed portion, and a remote area located adjacent to the adjacent area and apart from the exposed portion. A density of the conductive material per unit length is higher in the exposed portion than in the remote area. The elemental wires are twisted in both the exposed portion and the remote area. Gaps between the elemental wires of the exposed portion are filled with a sealant.

INSULATED ELECTRIC WIRE AND WIRE HARNESS

An insulated electric wire contains: an exposed portion insulation covering is removed; a covered portion with the insulation covering; and a water-stopping portion agent is placed over the exposed portion and an area of the covered portion that is adjacent to the exposed portion. The water-stopping portion contains: a filled area between the elemental wires between a conductor in the exposed portion filled with the water-stopping agent; an exposed portion outer circumferential area in which the water-stopping agent covers the outer circumference of the conductor in the exposed portion; and a covered portion outer circumferential area in which the water-stopping agent covers an outer circumference of the insulation covering in the area of the covered portion that is adjacent to the exposed portion. The layer thickness of the water-stopping agent is larger in the exposed portion outer circumferential area than in the covered portion outer circumferential area.

INSULATED ELECTRIC WIRE AND WIRE HARNESS

An insulated electric wire contains: an exposed portion insulation covering is removed; a covered portion with the insulation covering; and a water-stopping portion agent is placed over the exposed portion and an area of the covered portion that is adjacent to the exposed portion. The water-stopping portion contains: a filled area between the elemental wires between a conductor in the exposed portion filled with the water-stopping agent; an exposed portion outer circumferential area in which the water-stopping agent covers the outer circumference of the conductor in the exposed portion; and a covered portion outer circumferential area in which the water-stopping agent covers an outer circumference of the insulation covering in the area of the covered portion that is adjacent to the exposed portion. The layer thickness of the water-stopping agent is larger in the exposed portion outer circumferential area than in the covered portion outer circumferential area.

INSULATED ELECTRIC WIRE, WIRE HARNESS, AND INSULATED ELECTRIC WIRE PRODUCTION METHOD

An insulated electric wire includes a conductor in which elemental wires made of a metal material are twisted together; and an insulation covering that covers an outer circumference of the conductor. The insulated electric wire includes: an exposed portion in which the insulation covering is removed from the outer circumference of the conductor; a covered portion in which the insulation covering covers the outer circumference of the conductor, the exposed portion and the covered portion being provided adjacent to each other in a longitudinal axis direction; and a water-stopping portion in which gaps between the elemental wires in the exposed portion are filled with a water-stopping agent. In an area enclosed by the surface of the water-stopping agent, the surface of the elemental wires is in contact with only the water-stopping agent or another elemental wire.