According to the present invention, there are provided processes for preparing a porous composite material comprising a metal and a two-dimensional nanomaterial. In one aspect, the processes comprise the steps of: providing a powder comprising metal particles; heating the powder such that the metal particles fuse to form a porous scaffold; and forming a two-dimensional nanomaterial on a surface of the porous scaffold by chemical vapour deposition (CVD). Also provided are materials obtainable by the present processes, and products comprising said materials.

[Object] An object is to provide a SnZnO-based oxide sintered body which has a mechanical strength, a high density, and a low resistance characteristic and which is applied as a sputtering target, and a method for producing the same.

[Solving Means] In this oxide sintered body, Sn is contained with an atomic ratio of Sn/(Sn+Zn) being 0.1 or more and 0.9 or less, and a first additional element M is contained with an atomic ratio of M/(Sn+Zn+M+X) being 0.0001 or more and 0.04 or less relative to a total amount of all the metal elements, and a second additional element X is contained with an atomic ratio of X/(Sn+Zn+M+X) being 0.0001 or more and 0.1 or less relative to the total amount of all the metal elements, where the first additional element M is at least one selected from Si, Ti, Ge, In, Bi, Ce, Al, and Ga, and the second additional element X is at least one selected from Nb, Ta, W, and Mo, and a relative density of the sintered body is 90% or more and a specific electrical resistance of the sintered body is 1 .Math.cm or less.

[Object] An object is to provide a SnZnO-based oxide sintered body which has a mechanical strength, a high density, and a low resistance characteristic and which is applied as a sputtering target, and a method for producing the same.

[Solving Means] In this oxide sintered body, Sn is contained with an atomic ratio of Sn/(Sn+Zn) being 0.1 or more and 0.9 or less, and a first additional element M is contained with an atomic ratio of M/(Sn+Zn+M+X) being 0.0001 or more and 0.04 or less relative to a total amount of all the metal elements, and a second additional element X is contained with an atomic ratio of X/(Sn+Zn+M+X) being 0.0001 or more and 0.1 or less relative to the total amount of all the metal elements, where the first additional element M is at least one selected from Si, Ti, Ge, In, Bi, Ce, Al, and Ga, and the second additional element X is at least one selected from Nb, Ta, W, and Mo, and a relative density of the sintered body is 90% or more and a specific electrical resistance of the sintered body is 1 .Math.cm or less.

Disclosed is a device for applying marking tubes onto cables including: a driving mechanism for a cable along a driving axis; at least one buffer pipe in a producing position aligned with the driving axis, the buffer pipe having dimensions adapted both for a cable to be marked to run through the buffer pipe and for a number of marking tubes to be threaded onto the buffer pipe; a pushing unit engaging and pushing along the driving axis at least one first out marking tube of the marking tubes threaded on the buffer pipe until this first out marking tube exits the buffer pipe and is released onto the cable. Also disclosed is a method for applying marking tubes onto cables using a buffer pipe. The cable is always driven in the same forward direction and there is no limitation of cable length or marking tube number or location.

Disclosed is a device for applying marking tubes onto cables including: a driving mechanism for a cable along a driving axis; at least one buffer pipe in a producing position aligned with the driving axis, the buffer pipe having dimensions adapted both for a cable to be marked to run through the buffer pipe and for a number of marking tubes to be threaded onto the buffer pipe; a pushing unit engaging and pushing along the driving axis at least one first out marking tube of the marking tubes threaded on the buffer pipe until this first out marking tube exits the buffer pipe and is released onto the cable. Also disclosed is a method for applying marking tubes onto cables using a buffer pipe. The cable is always driven in the same forward direction and there is no limitation of cable length or marking tube number or location.

One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament.

A multi-conductor cable for a vehicle includes core wires respectively having a conductor formed by a plurality of twisted wires, and an insulating layer covering an outer periphery of the conductor, and a sheath layer disposed around the core wires. A marking portion is partially formed on an outer peripheral surface of the sheath layer, and a ratio of an arithmetic average roughness Ra2 of a peripheral region adjacent to the marking portion, with respect to an arithmetic average roughness Ra1 of the marking portion, at the outer peripheral surface, is 0.10 or greater and 0.90 or less.

The present invention relates to a composition for forming a conductive pattern by irradiation of electromagnetic waves capable of allowing excellent formation of a conductive micro-pattern on various polymer resin products comprising a polycarbonate resin or on resin layers by a simple method such as irradiation of electromagnetic waves and plating, and capable of reducing the degradation of the physical properties of the resin products or resin layers caused by the irradiation of electromagnetic waves, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern by irradiation of electromagnetic waves comprises: a polymer resin comprising a polycarbonate resin; and an electromagnetic wave-absorbing inorganic additive which absorbs an electromagnetic wave having a wavelength in the infrared region and satisfies the characteristic that a laser sensitivity Ls defined by a predetermined relational expression is 1.6<log(Ls)<6.0.

Disclosed is a production process for slotting an outer conductor of a leaky cable, through which an integrated production line incorporating a metal strap slotting production line, a metal strap longitudinal coating production line and a sheathing production line is provided. A semi-finished product from a leaky cable insulation process is subsequently processed by laser in a numerical control laser cutting device for cutting out corresponding slot holes in a metal strap to produce a slotted outer conductor. Then the slotted metal strap is embossed, and directly coated on an insulator in a longitudinal coating forming mould of the outer conductor. The final sheathing process is completed in a sheath plastic extruding machine to produce a finished leaky cable product. The processes of the outer conductor of the leaky cable, including the raw material punching, the longitudinal coating forming, and the outer sheathing, are finished at one time.

A theft deterrent product may be provided. First, a plurality of unique codes may be created. Then a plurality of indicia may be placed periodically and longitudinally on the product. The plurality of indicia may respectively correspond to the plurality of unique codes. The product may have an outer layer and into an portion. Placing the plurality of indicia may comprise etching through the outer layer and into the inner portion. In a database, the plurality of unique codes may be assigned to an organizational entity. The organizational entity may comprise a first enterprise.