Patent classifications
H01C1/01
Strain gauge
A strain gauge includes a flexible substrate; and resistors each formed of a Cr composite film. The resistors include a first resistor and a second resistor that are formed on one side of the substrate, and include a third resistor and a fourth resistor that are formed on another side of the substrate. The first resistor, the second resistor, the third resistor, and the fourth resistor constitute a Wheatstone bridge circuit.
Strain gauge
A strain gauge includes a flexible substrate; and resistors each formed of a Cr composite film. The resistors include a first resistor and a second resistor that are formed on one side of the substrate, and include a third resistor and a fourth resistor that are formed on another side of the substrate. The first resistor, the second resistor, the third resistor, and the fourth resistor constitute a Wheatstone bridge circuit.
SENSOR ASSEMBLY FOR A RESISTANCE TEMPERATURE SENSOR ELEMENT AND RESISTANCE TEMPERATURE SENSOR ELEMENT
A sensor assembly for a resistance temperature sensor element includes a substrate and a measuring structure disposed on the substrate. The substrate includes a first material and a stabilized second material. The first material is at least one of aluminum oxide, spinel (magnesium aluminate) and yttrium-aluminum-garnet. The stabilized second material is at least one of stabilized zirconium dioxide and stabilized hafnium dioxide. The stabilized second material is stabilized by containing an oxide of an element having a valence different from four. A coefficient of thermal expansion of the substrate deviates by less than 5% from a coefficient of thermal expansion of the measuring structure.
SENSOR ASSEMBLY FOR A RESISTANCE TEMPERATURE SENSOR ELEMENT AND RESISTANCE TEMPERATURE SENSOR ELEMENT
A sensor assembly for a resistance temperature sensor element includes a substrate and a measuring structure disposed on the substrate. The substrate includes a first material and a stabilized second material. The first material is at least one of aluminum oxide, spinel (magnesium aluminate) and yttrium-aluminum-garnet. The stabilized second material is at least one of stabilized zirconium dioxide and stabilized hafnium dioxide. The stabilized second material is stabilized by containing an oxide of an element having a valence different from four. A coefficient of thermal expansion of the substrate deviates by less than 5% from a coefficient of thermal expansion of the measuring structure.
RESISTOR ASSEMBLY FOR TAP CHANGER AND TAP CHANGER
A resistor assembly can be used in a tap changer. The resistor assembly may include: a resistor element, which is held by at least two resistor holders; a base plate with at least one opening and on which the at least two resistor holders holding the resistor element are arranged; a plurality of guides, respectively formed in each of the resistor holders and being configured to position a first end and a second end of the resistor element with respect to a longitudinal direction between the two resistor holders; and contact points of the resistor element, the contact points being electrically contacted by contacts of the tap changer in a condition where the resistor element is inserted into the resistor holder.
RESISTOR ASSEMBLY FOR TAP CHANGER AND TAP CHANGER
A resistor assembly can be used in a tap changer. The resistor assembly may include: a resistor element, which is held by at least two resistor holders; a base plate with at least one opening and on which the at least two resistor holders holding the resistor element are arranged; a plurality of guides, respectively formed in each of the resistor holders and being configured to position a first end and a second end of the resistor element with respect to a longitudinal direction between the two resistor holders; and contact points of the resistor element, the contact points being electrically contacted by contacts of the tap changer in a condition where the resistor element is inserted into the resistor holder.
High Frequency And High Power Thin Film Component
A surface mount component can include a first substrate and a second substrate arranged adjacent the first substrate to form a monolithic body. At least one of the first substrate or the second substrate can include a thermally conductive material that is electrically insulating. A thin film component can be arranged between the first substrate and the second substrate. A first terminal can be formed over a first end of the monolithic body. A second terminal can be formed over a second end of the monolithic body that is opposite the first end. A heat sink terminal can contact the thermally conductive material of the at least one of the first substrate or the second substrate.
High voltage resistor arrangement, electrode arrangement having such a high voltage resistor arrangement, method for manufacturing a high voltage resistor arrangement and ionization
A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.
High voltage resistor arrangement, electrode arrangement having such a high voltage resistor arrangement, method for manufacturing a high voltage resistor arrangement and ionization
A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.
Variable resistor
A variable resistor according to the present invention includes a substrate, a resistive element disposed on a first surface of the substrate, oil that coats an upper surface of the resistive element, and a slide member that slides on the upper surface of the resistive element coated with the oil, wherein an output of the variable registor changes as a position at which the slide member makes contact with the resistive element changes. The variable resistor further includes an oil repellent part that surrounds at least a part of the resistive element in plan view viewed from above the first surface of the substrate, the oil repellant part having surface free energy smaller than that of the resistive element, whereby oil can be stably held on a resistive element surface without forming irregularities on the resistive element surface.