Patent classifications
H01C1/01
Battery module and apparatus
The present application discloses a battery module and an apparatus, which relates to the field of battery technology and is used for optimizing the structure of the battery module. The battery module includes a battery, a connecting piece, a wire harness board and a temperature collecting component. The battery includes an electrode terminal and a top cover. The connecting piece is fixed with the electrode terminal; the wire harness plate is arranged on the top outside of the top cover, and is provided with an installation part and an elastic pressing part. The temperature collecting component is installed in the installation part and is located between the wire harness plate and the top cover. Among them, the elastic pressing part abuts against the connecting piece, and the temperature collecting component abuts against the top cover.
Support arrangement for an electrical protection assembly
A support arrangement for an electrical protection assembly for connection between an electrical power supply line and electrical equipment is provided. The support arrangement comprises a first insulator body and a second insulator body extending at right angles to the first insulator body, wherein the first and second insulator bodies are integrally formed into a unitary body. In an embodiment, the second insulator body extends from a lower end of the first insulator body, so as to define a unitary L-shaped support arrangement. In one version, the support arrangement comprises an L-shaped inner support frame around which the first and second insulator bodies are molded. The L-shaped inner support frame comprises a T-shaped metal connector having a first end from which a first fibre glass support arm extends, around which the first insulator body is molded, and a second end from which a second fibre glass support arm extends, around which the second insulator body is molded.
Support arrangement for an electrical protection assembly
A support arrangement for an electrical protection assembly for connection between an electrical power supply line and electrical equipment is provided. The support arrangement comprises a first insulator body and a second insulator body extending at right angles to the first insulator body, wherein the first and second insulator bodies are integrally formed into a unitary body. In an embodiment, the second insulator body extends from a lower end of the first insulator body, so as to define a unitary L-shaped support arrangement. In one version, the support arrangement comprises an L-shaped inner support frame around which the first and second insulator bodies are molded. The L-shaped inner support frame comprises a T-shaped metal connector having a first end from which a first fibre glass support arm extends, around which the first insulator body is molded, and a second end from which a second fibre glass support arm extends, around which the second insulator body is molded.
Connector with integrated thermal cutoff device for battery pack
A temperature-sensitive battery connector is disclosed. The connector can include a connector body and at least one conductor mounted to the connector body and configured to convey a current signal used to measure voltage from a battery pack or battery cell to a battery management system (BMS). The connector can include a thermal switching device mounted to the connector body and thermally coupled to a terminal of a battery pack or a battery cell. The thermal switching device can be configured to provide an overtemperature signal to the BMS by changing or interrupting a current conducted by at least one conductor when a temperature of the battery pack or battery cell exceeds a threshold temperature.
Component Stability Structure
An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.
SHUNT RESISTOR
Provided is a shunt resistor with an enhanced strength and reduced electrical resistance between a resistive element and terminals of the shunt resistor. This shunt resistor includes a first terminal and a second terminal each made of an electrically conductive metal material; and a resistive element disposed between the first terminal and the second terminal. The first terminal and the second terminal each have a through-hole, and the resistive element is embedded in the through-holes of the first terminal and the second terminal in a depth direction thereof. Regions connecting the resistive element to the first terminal and the second terminal each have an alloy portion formed along an inner peripheral surface of the through-hole.
Resistor element and method of manufacturing the same
A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.
Resistor element and method of manufacturing the same
A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.
ELECTRONIC CIRCUIT COMPRISING TRANSISTOR AND RESISTOR
A method of manufacturing an electronic circuit (or circuit module) (100) is disclosed. The electronic circuit comprises a transistor (1) and a resistor (2), the transistor comprising a source terminal (11), a drain terminal (12), a gate terminal (13), and a first body (10) of material providing a controllable semi-conductive channel between the source and drain terminals, and the resistor comprises a first resistor terminal (21), a second resistor terminal (22), and a second body (20) of material providing a resistive current path between the first resistor terminal and the second resistor terminal. The method comprises: forming the first body (10); and forming the second body (20), wherein the first body comprises a first quantity (100) of a metal oxide and the second body comprises a second quantity (200) of said metal oxide. Corresponding electronic circuits are disclosed.
ELECTRONIC CIRCUIT COMPRISING TRANSISTOR AND RESISTOR
A method of manufacturing an electronic circuit (or circuit module) (100) is disclosed. The electronic circuit comprises a transistor (1) and a resistor (2), the transistor comprising a source terminal (11), a drain terminal (12), a gate terminal (13), and a first body (10) of material providing a controllable semi-conductive channel between the source and drain terminals, and the resistor comprises a first resistor terminal (21), a second resistor terminal (22), and a second body (20) of material providing a resistive current path between the first resistor terminal and the second resistor terminal. The method comprises: forming the first body (10); and forming the second body (20), wherein the first body comprises a first quantity (100) of a metal oxide and the second body comprises a second quantity (200) of said metal oxide. Corresponding electronic circuits are disclosed.