A shunt resistor module which is coupled to a printed circuit board to be used for current measurement, includes: a resistor portion configured to have predetermined resistance; at least two terminal portions configured to extend from opposite ends of the resistor portion; lead pins fixed to first sides of the terminal portions to protrude to be electrically connected to the printed circuit board; and an exterior member formed to at least partially cover first surfaces of the terminal portions and to have pin holes opened to expose the lead pins and screw holes formed to be screwed to the printed circuit board.

An apparatus includes a laminated bus bar assembly with first and second bus bars and an intervening insulator layer. A surge arrestor (e.g., a metal oxide varistor) has a body mounted on the bus bar assembly and first and second terminals on first and second opposite sides of the body. In some embodiments, the body may be at least partially disposed in an opening in the first bus bar and the second terminal may be conductively bonded to a surface of the second bus bar that faces the insulator layer. In some embodiments, the second terminal may include a conductive stud passing through an opening in the second bus bar. The apparatus may include a spring clamp attached to the first bus bar and contacting the first side of the body to retain the body.

The present disclosure relates to a modular current limiting resistor comprising a plurality of plate resistors, wherein the plate resistors each comprise a pair of coupling pieces and a conducting line integrally formed with the coupling pieces and having a zigzag shape between the coupling pieces; a pair of support frames which support the stacked plate resistors; a plurality of coupling members which pass through one of the support frames, pass the coupling pieces, and are inserted into the plate resistors; a plurality of conductor rings disposed between the plate resistors while passing through and being inserted into the coupling members, and which electrically connect the conducting line on each of the plate resistors; and at least one unit module comprising a plurality of insulating rings disposed between the plate resistors while passing through and being inserted into the coupling members so as to insulate the plate resistors.

A metal oxide varistor (MOV) device including a MOV chip having first and second electrodes disposed on opposing side thereof, a first lead frame portion including a first contact tab electrically connected to the first electrode and a first lead contiguous with the first contact tab and extending away from the MOV chip, a second lead frame portion including a second contact tab electrically connected to the second electrode and a second lead contiguous with the second contact tab and extending away from the MOV chip, and a device body encasing the MOV chip, the first contact tab, the second contact tab, and portions of the first and second leads, wherein the first and second leads extend out of the device body and are bent into flat abutment with a bottom surface of the device body.

A metal oxide varistor (MOV) device including a MOV chip having first and second electrodes disposed on opposing side thereof, a first lead frame portion including a first contact tab electrically connected to the first electrode and a first lead contiguous with the first contact tab and extending away from the MOV chip, a second lead frame portion including a second contact tab electrically connected to the second electrode and a second lead contiguous with the second contact tab and extending away from the MOV chip, and a device body encasing the MOV chip, the first contact tab, the second contact tab, and portions of the first and second leads, wherein the first and second leads extend out of the device body and are bent into flat abutment with a bottom surface of the device body.

A method of manufacturing a sensor body used in an oil temperature sensor includes mounting a thermistor on a scheduled first resin mold portion and a scheduled second resin mold portion. The manufacturing method includes molding the scheduled first resin mold portion, the scheduled second resin mold portion, and the thermistor to form a resin mold portion. The manufacturing method includes cutting connecting portions, after the resin mold portion is formed, and separating a scheduled first-terminal-portion forming portion and a scheduled second-terminal-portion forming portion.

A method of manufacturing a sensor body used in an oil temperature sensor includes mounting a thermistor on a scheduled first resin mold portion and a scheduled second resin mold portion. The manufacturing method includes molding the scheduled first resin mold portion, the scheduled second resin mold portion, and the thermistor to form a resin mold portion. The manufacturing method includes cutting connecting portions, after the resin mold portion is formed, and separating a scheduled first-terminal-portion forming portion and a scheduled second-terminal-portion forming portion.

In an embodiment an electrical component includes an electrical resistor having a PTC ceramic with a reference temperature exceeding 150° C., wherein, at the reference temperature, a reference resistance is twice an amount of a minimum resistance of the PTC ceramic.

In an embodiment an electrical component includes an electrical resistor having a PTC ceramic with a reference temperature exceeding 150° C., wherein, at the reference temperature, a reference resistance is twice an amount of a minimum resistance of the PTC ceramic.

The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.