Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.

An electrical element includes an optically-detectable pattern of embedded information. A plurality of thin-film layers is applied on the surface of the substrate wherein one or more of the thin-film layers is at least partially transparent. The plurality of thin-film layers overlaps in an encoding region to form an optical layer structure, wherein at least one of the thin-film layers in the optical layer structure contributes to an electrical function of the electrical element. At least one of the thin-film layers in the optical layer structure includes an information-encoding pattern which contributes to an optically-detectable interference image when illuminated by incident light, and wherein the optically-detectable interference image corresponds to at least a portion of the pattern of embedded information.

An electrical element includes an optically-detectable pattern of embedded information. A plurality of thin-film layers is applied on the surface of the substrate wherein one or more of the thin-film layers is at least partially transparent. The plurality of thin-film layers overlaps in an encoding region to form an optical layer structure, wherein at least one of the thin-film layers in the optical layer structure contributes to an electrical function of the electrical element. At least one of the thin-film layers in the optical layer structure includes an information-encoding pattern which contributes to an optically-detectable interference image when illuminated by incident light, and wherein the optically-detectable interference image corresponds to at least a portion of the pattern of embedded information.

To provide an electronic component capable of achieving both adhesion and visibility of a mark to an element body. An electronic component includes an element body and a mark formed on the element body. A main material of the mark is different from a material of the element body. The mark includes a first portion that constitutes a part of the mark and a second portion located at a position different from the first portion and connected to the first portion. A ratio of a main material of the mark included in the first portion is lower than a ratio of a main material of the mark included in the second portion.

A method for making resistors includes: forming a protective layer on a metal plate; patterning the metal plate to form a plurality of spaced-apart resistor wires; forming a plurality of bottom parts on the metal plate, each of the bottom parts covering a portion of a respective one of the resistor wires such that the respective resistor wire defines two opposite electrode forming regions; laser-marking the protective layer to form a plurality of identification codes; laser-cutting the protective layer and the metal plate to form a plurality of spaced-apart pre-formed resistors; and forming two terminal electrodes respectively on the two opposite electrode forming regions of each of the resistor wires.

An electrical element includes an optically-detectable pattern of embedded information. A plurality of thin-film layers is applied on the surface of the substrate wherein one or more of the thin-film layers is at least partially transparent. The plurality of thin-film layers overlaps in an encoding region to form an optical layer structure, wherein at least one of the thin-film layers in the optical layer structure contributes to an electrical function of the electrical element. At least one of the thin-film layers in the optical layer structure includes an information-encoding pattern which contributes to an optically-detectable interference image when illuminated by incident light, and wherein the optically-detectable interference image corresponds to at least a portion of the pattern of embedded information.

An electrical element includes an optically-detectable pattern of embedded information. A plurality of thin-film layers is applied on the surface of the substrate wherein one or more of the thin-film layers is at least partially transparent. The plurality of thin-film layers overlaps in an encoding region to form an optical layer structure, wherein at least one of the thin-film layers in the optical layer structure contributes to an electrical function of the electrical element. At least one of the thin-film layers in the optical layer structure includes an information-encoding pattern which contributes to an optically-detectable interference image when illuminated by incident light, and wherein the optically-detectable interference image corresponds to at least a portion of the pattern of embedded information.

A shunt resistor has a resistance element with a predetermined resistivity at least at a part, and the shunt resistor to which a bonding wire is to be connected. The bonding wire is for detecting a value of current flowing between two electrodes bridged through the shunt resistor by detecting a voltage drop at the resistance element. The shunt resistor includes: a pair of connection parts to be respectively electrically connected to the two electrodes; a bridge part having the resistance element, extending from one of the connection parts to the other of the connection parts, and bridging the pair of connection parts; and a mark configured to define a virtual line segment. The mark is arranged to allow the virtual line segment to be oblique with respect to an extending direction of the bridge part.

A shunt resistor has a resistance element with a predetermined resistivity at least at a part, and the shunt resistor to which a bonding wire is to be connected. The bonding wire is for detecting a value of current flowing between two electrodes bridged through the shunt resistor by detecting a voltage drop at the resistance element. The shunt resistor includes: a pair of connection parts to be respectively electrically connected to the two electrodes; a bridge part having the resistance element, extending from one of the connection parts to the other of the connection parts, and bridging the pair of connection parts; and a mark configured to define a virtual line segment. The mark is arranged to allow the virtual line segment to be oblique with respect to an extending direction of the bridge part.

To provide ceramic electronic component capable of suppressing breakage of identification mark and element body and intrusion of liquid into element body. Ceramic electronic component includes element body including ceramic as main material, barrier layer formed on surface of element body and including ceramic as main material, and identification mark formed on surface of barrier layer. Element body, barrier layer, and identification mark include glass material. Proportion of glass material included in barrier layer is higher than proportion of glass material included in element body.