A glass sealed thermistor having a shock absorbing structure includes: a thermistor device whose resistance value changes according to temperature; a glass sealing layer that hermetically protects a head and a contact electrode of the glass sealed thermistor; a pair of conductive supporters having an electrical conductor function and a thermistor device support function; a shock absorbing structure formed by surrounding the pair of conductive supporters adjacent to the glass sealing layer; and a coating layer is coated on the glass sealing layer with polymer material.

An anti-surge resistor and a fabrication method thereof are provided. The current anti-surge resistor includes a substrate made by a varistor material, a resistance layer disposed on the substrate, a first terminal electrode, and a second terminal electrode. In the fabrication method of the current anti-surge resistor, at first, the substrate made by the varistor material is provided. Then, the resistance layer is formed on the substrate to provide a main body, in which the main body includes the substrate and the resistance layer, and has two opposite terminals. Thereafter, the first terminal electrode is formed on one terminal of the main body, and the second terminal electrode is formed on the other terminal of the main body.

An anti-surge resistor and a fabrication method thereof are provided. The current anti-surge resistor includes a substrate made by a varistor material, a resistance layer disposed on the substrate, a first terminal electrode, and a second terminal electrode. In the fabrication method of the current anti-surge resistor, at first, the substrate made by the varistor material is provided. Then, the resistance layer is formed on the substrate to provide a main body, in which the main body includes the substrate and the resistance layer, and has two opposite terminals. Thereafter, the first terminal electrode is formed on one terminal of the main body, and the second terminal electrode is formed on the other terminal of the main body.

A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

The present invention discloses an automatic tripping and anti-falling lightning arrester which includes an insulator main body, a lightning arrester body and an anti-falling member, wherein the insulator main body with a sealed cylinder structure, and a magnet adsorption surface inside the insulator main body; the lightning arrester body has a disconnection unit and a lightning arresting core respectively arranged from top to bottom, and the lightning arrester body is located inside the insulator main body, the disconnection unit includes a magnetic tripping module wherein a magnet is provided, and wherein the disconnection unit is adsorbed onto the magnet adsorption surface, wherein aging of the lightning arresting core results in a thermal effect inside the magnetic tripping module, which makes the disconnection unit disconnected from the magnet adsorption surface, and wherein the anti-falling member is provided on the insulator main body.

An anti-surge resistor and a fabrication method thereof are provided. The current anti-surge resistor includes a substrate made by a varistor material, a resistance layer disposed on the substrate, a first terminal electrode, and a second terminal electrode. In the fabrication method of the current anti-surge resistor, at first, the substrate made by the varistor material is provided. Then, the resistance layer is formed on the substrate to provide a main body, in which the main body includes the substrate and the resistance layer, and has two opposite terminals. Thereafter, the first terminal electrode is formed on one terminal of the main body, and the second terminal electrode is formed on the other terminal of the main body.

An anti-surge resistor and a fabrication method thereof are provided. The current anti-surge resistor includes a substrate made by a varistor material, a resistance layer disposed on the substrate, a first terminal electrode, and a second terminal electrode. In the fabrication method of the current anti-surge resistor, at first, the substrate made by the varistor material is provided. Then, the resistance layer is formed on the substrate to provide a main body, in which the main body includes the substrate and the resistance layer, and has two opposite terminals. Thereafter, the first terminal electrode is formed on one terminal of the main body, and the second terminal electrode is formed on the other terminal of the main body.

A composite electronic component includes: a body part including a dielectric portion; first and second external electrodes disposed on outer surfaces of the body part; a plurality of first and second electrodes disposed inside of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; third and fourth electrodes disposed on an upper portion of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; a gap provided between the third and fourth electrodes; a groove disposed below the gap; and an electrostatic discharge (ESD) layer disposed in the gap.