The present invention relates to a PT heater and, more specifically, to a PTC heater which: mechanically fixes a heating element, a terminal, an insulating layer, and a heat-radiating unit, which constitute the PTC heater, by bending a fixing projection of a hook structure formed at a heat rod; and further has an auxiliary fixing protrusion capable of fixing the position of the heating element so as to increase the adhesiveness between the PTC element and the heat-radiating unit, thereby enabling performance to improve and facilitating assembly through the heat rod.

The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the back end of the line structure.

The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the back end of the line structure.

A PTC heating element has two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween. The PTC element is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element, and the metallization provided on the other of the main side surfaces is only assigned to the other potential for energizing the PTC element, as well as an electric heating device containing such a PTC heating element. With regard to better heat decoupling, the insulating layer may be glued to the PTC element, and the coating of the insulating layers is in direct electrically conductive contact with the metallization of the PTC element.

A PTC heating element has two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween. The PTC element is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element, and the metallization provided on the other of the main side surfaces is only assigned to the other potential for energizing the PTC element, as well as an electric heating device containing such a PTC heating element. With regard to better heat decoupling, the insulating layer may be glued to the PTC element, and the coating of the insulating layers is in direct electrically conductive contact with the metallization of the PTC element.

A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.

A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.

Disclosed are a resistor, a heat dissipater and a combinatory device of the resistor and the heat dissipater, and relates to the field of power electronics. The resistor is cylindrical, and comprises a metal end, an insulating part, a casing, metal bars, a resistor wire, thermally conductive insulating fillers and a metal connection mechanism. The metal connection mechanism of the resistor and the heat dissipater are connected by means of direct contact. The structure and the connection method can shorten the length of the resistor, completely insulate the electrical circuits of the resistor from the possible leakage of the water inlet- and outlet-pipe of the heat dissipater, and enable the combinatory device of the resistor and the heat dissipater to be structurally more compact and the connections thereof cleaner.

Disclosed are a resistor, a heat dissipater and a combinatory device of the resistor and the heat dissipater, and relates to the field of power electronics. The resistor is cylindrical, and comprises a metal end, an insulating part, a casing, metal bars, a resistor wire, thermally conductive insulating fillers and a metal connection mechanism. The metal connection mechanism of the resistor and the heat dissipater are connected by means of direct contact. The structure and the connection method can shorten the length of the resistor, completely insulate the electrical circuits of the resistor from the possible leakage of the water inlet- and outlet-pipe of the heat dissipater, and enable the combinatory device of the resistor and the heat dissipater to be structurally more compact and the connections thereof cleaner.

A resistor includes a first resistor element. The first resistor element is connected to at least a first electrical terminal and a second electrical terminal. The first resistor element is configured to directly contact cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element. The resistor may also include a second resistor element connected to at least the first electrical terminal and the second electrical terminal, where the second resistor element is configured to directly contact the cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.