A PTC thermistor module for a temperature control device may include at least one PTC thermistor element, two electrically insulating insulator plates, and a plurality of electrical conductors. The PTC thermistor element may have a flat element cross section, two opposing large outer surfaces, and two opposing small outer surfaces connecting the two large outer surfaces. The two insulator plates may be respectively connected to one of the two large outer surfaces. The plurality of electrical conductors may be configured as a plurality of electrically conductive conductor coatings, which may each be disposed on an associated insulator plate of the two insulator plates. At least one first conductor coating may be electrically connected to a first large outer surface of the two large outer surfaces. At least two second conductor coatings may be electrically connected to a second large outer surface of the two large outer surfaces.

A PTC thermistor module for a temperature control device may include at least one PTC thermistor element, two electrically insulating insulator plates, and a plurality of electrical conductors. The PTC thermistor element may have a flat element cross section, two opposing large outer surfaces, and two opposing small outer surfaces connecting the two large outer surfaces. The two insulator plates may be respectively connected to one of the two large outer surfaces. The plurality of electrical conductors may be configured as a plurality of electrically conductive conductor coatings, which may each be disposed on an associated insulator plate of the two insulator plates. At least one first conductor coating may be electrically connected to a first large outer surface of the two large outer surfaces. At least two second conductor coatings may be electrically connected to a second large outer surface of the two large outer surfaces.

A resistor includes an elongated cylindrical body having nodes and elongated members. The elongated members interconnect the nodes to form openings between the nodes and the elongated members for the flow therethrough of a cooling fluid. The body is configured to receive electric current from a powered system and to conduct and provide electric resistance to the electric current to dissipate at least part of the electric current as heat from the body. The body also is configured to be coupled with at least one other resistor of the powered system in one or more of a parallel or series arrangement in an electric circuit.

A resistor includes an elongated cylindrical body having nodes and elongated members. The elongated members interconnect the nodes to form openings between the nodes and the elongated members for the flow therethrough of a cooling fluid. The body is configured to receive electric current from a powered system and to conduct and provide electric resistance to the electric current to dissipate at least part of the electric current as heat from the body. The body also is configured to be coupled with at least one other resistor of the powered system in one or more of a parallel or series arrangement in an electric circuit.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

An electrically operated vehicle includes a braking resistor in a heat sink cover. The heat sink cover has an air throughflow body having vent openings and an air throughflow direction perpendicular to a direction of travel of the vehicle. The heat sink cover includes an inlet flap on an air inflow side and an outlet flap on an air outflow side. An opening mechanism opens and closes the flaps. In the closed state, the flaps are oriented along the direction of travel and obliquely to the air throughflow direction. In a plan view of the vent openings, the vent openings are at least 90% covered by the flaps in the closed state and at most 60% covered by the flaps in the opened state. The flaps are disposed symmetrically to a vehicle center axis, and the vent openings are oriented parallel to side surfaces of the vehicle.

An electrically operated vehicle includes a braking resistor in a heat sink cover. The heat sink cover has an air throughflow body having vent openings and an air throughflow direction perpendicular to a direction of travel of the vehicle. The heat sink cover includes an inlet flap on an air inflow side and an outlet flap on an air outflow side. An opening mechanism opens and closes the flaps. In the closed state, the flaps are oriented along the direction of travel and obliquely to the air throughflow direction. In a plan view of the vent openings, the vent openings are at least 90% covered by the flaps in the closed state and at most 60% covered by the flaps in the opened state. The flaps are disposed symmetrically to a vehicle center axis, and the vent openings are oriented parallel to side surfaces of the vehicle.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

A PTC thermistor module for a temperature control device may include at least one PTC thermistor element, two electrically insulating insulator plates, and a plurality of electrical conductors. The PTC thermistor element may have a flat element cross section, two opposing large outer surfaces, and two opposing small outer surfaces connecting the two large outer surfaces. The two insulator plates may be respectively connected to one of the two large outer surfaces. The plurality of electrical conductors may be configured as a plurality of electrically conductive conductor coatings, which may each be disposed on an associated insulator plate of the two insulator plates. At least one first conductor coating may be electrically connected to a first large outer surface of the two large outer surfaces. At least two second conductor coatings may be electrically connected to a second large outer surface of the two large outer surfaces.