Disclosed are a resistor, a heat dissipater and a combinatory device of the resistor and the heat dissipater, and relates to the field of power electronics. The resistor is cylindrical, and comprises a metal end, an insulating part, a casing, metal bars, a resistor wire, thermally conductive insulating fillers and a metal connection mechanism. The metal connection mechanism of the resistor and the heat dissipater are connected by means of direct contact. The structure and the connection method can shorten the length of the resistor, completely insulate the electrical circuits of the resistor from the possible leakage of the water inlet- and outlet-pipe of the heat dissipater, and enable the combinatory device of the resistor and the heat dissipater to be structurally more compact and the connections thereof cleaner.

A reflowable thermal fuse including a fuse body, a conductive composite element disposed within the fuse body, first and second conductive terminals connected to the conductive composite element and extending out of the fuse body, a removable barrier covering a surface of the conductive composite element and in electrical communication with the first and second conductive terminals, and a solvent element disposed on the removable barrier and separated from the conductive composite element by the removable barrier, wherein the removable barrier has a fusing temperature that is greater than a reflow temperature of the reflowable thermal fuse.

A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.

A chip resistor includes an insulating substrate, a first electrode, a second electrode, a resistor, a first heat transfer layer, a second heat transfer layer, and an insulating protective layer. The first heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a first front electrode. The second heat transfer layer is separated from the first heat transfer layer. The second heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a second front electrode.

A chip resistor includes an insulating substrate, a first electrode, a second electrode, a resistor, a first heat transfer layer, a second heat transfer layer, and an insulating protective layer. The first heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a first front electrode. The second heat transfer layer is separated from the first heat transfer layer. The second heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a second front electrode.

A shunt resistor, at least a part of which has a resistive element with pre-set resistivity, is configured to bridge between two electrodes and detect a current value of a current flowing between the electrodes by detecting a voltage drop in the resistive element. The shunt resistor includes two connecting parts affixed to the electrodes via a conductive adhesive, respectively, and the connecting parts electrically connected to the affixed electrodes, a bridging part bridging between the connecting parts by being extended from one of the connecting parts to the other one of the connecting parts, and two bonding wires used to detect a voltage drop in the resistive element. The two bonding wires are extracted parallel to an extension direction of the bridging part to a same direction.

A shunt resistor, at least a part of which has a resistive element with pre-set resistivity, is configured to bridge between two electrodes and detect a current value of a current flowing between the electrodes by detecting a voltage drop in the resistive element. The shunt resistor includes two connecting parts affixed to the electrodes via a conductive adhesive, respectively, and the connecting parts electrically connected to the affixed electrodes, a bridging part bridging between the connecting parts by being extended from one of the connecting parts to the other one of the connecting parts, and two bonding wires used to detect a voltage drop in the resistive element. The two bonding wires are extracted parallel to an extension direction of the bridging part to a same direction.

A cooling device having internal pathways that define separate first and second flow circuits, each configured to direct a coolant at first and second mass flow rates to cool separate first and second surfaces of the cooling device. The internal pathways further define cooling channels into which the first and second flow circuits converge to cool separate third and fourth surfaces of the cooling device. The cooling device may be used simultaneously cool multiple electronic components that have similar or different cooling requirements.

A cooling device having internal pathways that define separate first and second flow circuits, each configured to direct a coolant at first and second mass flow rates to cool separate first and second surfaces of the cooling device. The internal pathways further define cooling channels into which the first and second flow circuits converge to cool separate third and fourth surfaces of the cooling device. The cooling device may be used simultaneously cool multiple electronic components that have similar or different cooling requirements.

The invention relates to a separating device for an overvoltage protection element, wherein the separating device is to be arranged between the overvoltage protection element and a thermal disconnector, wherein the separating device has a first insulating layer and a second insulating layer, wherein a conductive layer is arranged between the first insulating layer and the second insulating layer, wherein the first insulating layer has a first cutout for a contact with the disconnector, and wherein the second insulating layer has a second cutout for a contact with the overvoltage protection element, wherein the cutouts provide a possibility for contacting the conductive layer and the conductive layer provides a thermal bridge between the overvoltage protection element and the thermal disconnector, with the insulating layers making both a thermal and an electrical insulation available, so that heat of the overvoltage protection element can be conducted in a focused manner to the thermal disconnector.