Patent classifications
H01C1/12
Resistor, a heat dissipater and a combinatory device of resistor and heat dissipater
Disclosed are a resistor, a heat dissipater and a combinatory device of the resistor and the heat dissipater, and relates to the field of power electronics. The resistor is cylindrical, and comprises a metal end, an insulating part, a casing, metal bars, a resistor wire, thermally conductive insulating fillers and a metal connection mechanism. The metal connection mechanism of the resistor and the heat dissipater are connected by means of direct contact. The structure and the connection method can shorten the length of the resistor, completely insulate the electrical circuits of the resistor from the possible leakage of the water inlet- and outlet-pipe of the heat dissipater, and enable the combinatory device of the resistor and the heat dissipater to be structurally more compact and the connections thereof cleaner.
Chip resistor and method for manufacturing same
A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver as a main metal component an 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer lower in specific resistance than the main electrode layer, a laminate part where the auxiliary electrode layer and the main electrode layer are laminated in order on a single surface of the insulating substrate; and an exposed part of the auxiliary electrode layer where a part of the auxiliary electrode layer is not covered with the main electrode layer on a far side from the resistor, and part that extend from a near side to the far side with respect to the resistor.
Chip resistor and method for manufacturing same
A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver as a main metal component an 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer lower in specific resistance than the main electrode layer, a laminate part where the auxiliary electrode layer and the main electrode layer are laminated in order on a single surface of the insulating substrate; and an exposed part of the auxiliary electrode layer where a part of the auxiliary electrode layer is not covered with the main electrode layer on a far side from the resistor, and part that extend from a near side to the far side with respect to the resistor.
Protection element
A protective element including (i) a PTC element having an opening passing through in the thickness direction, and (ii) a first electrode and a second electrode positioned on both main surfaces of the PTC element, the protective element characterized in that the first electrode extends from a main surface of the PTC element over an edge thereof and into the opening wherein the PTC element is not prevented from expanding even when secured by a screw or caulking.
Protection element
A protective element including (i) a PTC element having an opening passing through in the thickness direction, and (ii) a first electrode and a second electrode positioned on both main surfaces of the PTC element, the protective element characterized in that the first electrode extends from a main surface of the PTC element over an edge thereof and into the opening wherein the PTC element is not prevented from expanding even when secured by a screw or caulking.
METHOD FOR MANUFACTURING SHUNT RESISTOR
In manufacturing method of shunt resistor according to the present invention, at least one of first and second conductors that is thicker than a resistance alloy plate member includes a joining surface abutted to the resistance alloy plate member with their edges on one side in a plate-thickness direction being aligned with each other, a first inclined surface that is gradually located on one side in the plate-thickness direction from the joining surface toward the side opposite to the resistance alloy plate member in the plate-surface direction, and a first plate surface extending to the side opposite to the resistance alloy plate member in the plate-surface direction from the first inclined surface. Electron beams or laser is emitted to the joining surfaces of the conductor having the larger thickness and the resistance alloy plate member from one side in the plate-thickness direction to weld the joining surfaces.
Chip Resistor and Method for Manufacturing Same
Provided are: a chip resistor whose resistance value can be adjusted with high accuracy while maintaining high sulfurization resistance of electrodes of the chip resistor even in the case where the resistance value of the chip resistor is low; and a method for manufacturing this chip resistor. This chip resistor (1) includes: an insulating film that covers a resistor substance (4) formed so as to make contact with both of a pair of electrodes (3, 3) formed on an upper surface (2A) of an insulating substrate (2). Each of the pair of electrodes (3, 3) includes: (1) a main electrode layer (3B) that contains silver as a main metal component and 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer (3A) that is lower in specific resistance than the main electrode layer (3B); (2) a laminate part where the auxiliary electrode layer (3A) and the main electrode layer (3B) are sequentially laminated in this order on a single surface of the insulating substrate (2); and (3) an exposed part (3A1) of the auxiliary electrode layer (3A) where a part of the auxiliary electrode layer (3A) is not covered with the main electrode layer (3B) on a far side from the resistor substance (4), and parts (3B1) that extend from a near side to the far side with respect to the resistor substance (4).
Brush type contact material and manufacturing method for the same
The present invention relates to a brush type contact material, including one or more curved metal pawls of which ends come into contact with objects to be contacted. The ends of the pawls have an arc-like cross section in a thickness direction, a curvature radius R1 on a front side from a contact point with the object to be contacted and a curvature radius R2 on a back side from the contact point are formed so as to be R1R2, and also both ends in a width direction of the pawl are chamfered. At this time, preferably, R1 is larger than R2 (R1>R2), and R1 divided by R2 (R1/R2) is 3.0 or less. The brush type contact material according to the present invention enables a smoother sliding movement than ever before and can be relatively simply manufactured.
Brush type contact material and manufacturing method for the same
The present invention relates to a brush type contact material, including one or more curved metal pawls of which ends come into contact with objects to be contacted. The ends of the pawls have an arc-like cross section in a thickness direction, a curvature radius R1 on a front side from a contact point with the object to be contacted and a curvature radius R2 on a back side from the contact point are formed so as to be R1R2, and also both ends in a width direction of the pawl are chamfered. At this time, preferably, R1 is larger than R2 (R1>R2), and R1 divided by R2 (R1/R2) is 3.0 or less. The brush type contact material according to the present invention enables a smoother sliding movement than ever before and can be relatively simply manufactured.