A resistor arrangement for measuring current strength having connection elements and a resistor element between the connection elements. The connection elements and the resistor element are arranged in a plane and in a row such that the arrangement is strip-shaped and has its smallest spatial extent perpendicular to the current direction. The resistor element has two contact sides and the connection elements each have a contact face connected to the contact sides. When current flows through the arrangement, current flow lines are formed which are deflected at at least one of the contact sides by an angle of at least 5° at the transition from the connection element to the resistor element.

A resistor arrangement for measuring current strength having connection elements and a resistor element between the connection elements. The connection elements and the resistor element are arranged in a plane and in a row such that the arrangement is strip-shaped and has its smallest spatial extent perpendicular to the current direction. The resistor element has two contact sides and the connection elements each have a contact face connected to the contact sides. When current flows through the arrangement, current flow lines are formed which are deflected at at least one of the contact sides by an angle of at least 5° at the transition from the connection element to the resistor element.

A semiconductor element includes: a first resistive layer; a second resistive layer provided separately from the first resistive layer and having a resistance value different from that of the first resistive layer; a first external connection electrode electrically connected to one end of the first resistive layer; a second external connection electrode provided separately from the first external connection electrode and electrically connected to one end of the second resistive layer; and a passivation film provided to cover the first and second external connection electrodes and having a first opening and a second opening to which top surfaces of the first and second external connection electrodes are partly exposed, wherein the first opening and the second opening having planar patterns with shapes different from each other.

The invention relates to a switch including a switch housing, a contact system and a base disposed in the switch housing, a resistive element for diagnosing a state of a switch, and at least two terminals leading from the base. The resistive element has a specific resistance value. The resistive element is a conductive material formed on the base, the terminals being electrically connected by the conductive material.

The invention relates to a switch including a switch housing, a contact system and a base disposed in the switch housing, a resistive element for diagnosing a state of a switch, and at least two terminals leading from the base. The resistive element has a specific resistance value. The resistive element is a conductive material formed on the base, the terminals being electrically connected by the conductive material.

A thermistor has a thermistor element, a protective film, and an electrode portion. The protective film is formed of a SiO.sub.2 film having a film thickness in a range of 50 nm or more and 1000 nm or less. The protective film is formed in contact with the thermistor element. Alkali metal is unevenly distributed in a region including an interface between the thermistor element and the protective film.

A thermistor has a thermistor element, a protective film, and an electrode portion. The protective film is formed of a SiO.sub.2 film having a film thickness in a range of 50 nm or more and 1000 nm or less. The protective film is formed in contact with the thermistor element. Alkali metal is unevenly distributed in a region including an interface between the thermistor element and the protective film.

A variable resistor includes: a main body and a rotating part vertically separated away from each other, among which the main body includes: a substrate having a first main surface, a second main surface and a through hole vertically penetrating the first main surface and the second main surface; a first conductive portion and a second conductive portion provided on the first main surface; a resistor body connected thereto; an electrode positioned closer to the through hole than the resistor body; and a third conductive portion (i) provided on each of the second main surface and a partition wall surface for partitioning the through hole and (ii) connected to the electrode, and the rotating part includes: an opposing part rotatable in a circumferential direction; and a slider configured to conductively slide as the rotating part rotates.

A terminal connecting structure is provided with each of the electrodes provided on the element forming the electronic component; and the terminals respectively having the connecting portions arranged along the electrodes respectively. In addition, the terminal connecting structure is provided with clearance forming portions configured to respectively form the respective clearances between the electrodes and the connecting portions respectively; and the connecting materials respectively provided in the clearances, the connecting material being configured to electrically connect the connecting portions and the electrodes respectively.

A thermistor chip is provided, which includes a thermosensitive ceramic substrate, a surface electrode and a bottom electrode. The surface electrode and the bottom electrode are respectively arranged on the two surfaces of the thermosensitive ceramic substrate. The surface electrode is a silver layer. The bottom electrode consists of a silver layer, a titanium-tungsten alloy layer, a copper layer and a gold layer, laminating on the thermosensitive ceramic substrate in turn from inside to outside. A preparation method thereof is also provided. The thermistor chip can meet the requirements of both solder paste reflow soldering and wire bonding process simultaneously, and has the advantages of good bonding effect and high temperature resistance, high reliability and high stability.