A method of forming a resistor circuit, the method comprising forming a first resistor comprising a first type of resistor, forming a second resistor comprising a second type of resistor, the first type of resistor being different from the second type of resistor and simultaneously doping a first part of the first resistor and a second part of the second resistor, the first resistor and the second resistor being configured such that doping of the first part of the first resistor and the second part of the second resistor defines a temperature coefficient of the first resistor and a temperature coefficient of the second resistor, wherein the temperature coefficient of the first resistor and the temperature coefficient of the second resistor have opposite signs.

Designs and methodologies related to attenuators having a thin-film resistor assembly are disclosed. In some embodiments, the thin-film assembly can include a first and second thin-film resistor, each having a main portion with an input end and an output end. The input end of the first thin-film resistor is interconnected to the input end of the second thin-film resistors, and the output end of the first thin-film resistor is interconnected to the output end of the second thin-film resistor. The first and second thin-film resistors are disposed relative to one another so as to define a separation. The separation region reduces the likelihood of hot spot regions forming at or near the center of the thin-film structure and improves power handling capability for a given resistor width. Also disclosed are examples of how the foregoing features can be implemented in different products and methods of fabrication.

Designs and methodologies related to attenuators having a thin-film resistor assembly are disclosed. In some embodiments, the thin-film assembly can include a first and second thin-film resistor, each having a main portion with an input end and an output end. The input end of the first thin-film resistor is interconnected to the input end of the second thin-film resistors, and the output end of the first thin-film resistor is interconnected to the output end of the second thin-film resistor. The first and second thin-film resistors are disposed relative to one another so as to define a separation. The separation region reduces the likelihood of hot spot regions forming at or near the center of the thin-film structure and improves power handling capability for a given resistor width. Also disclosed are examples of how the foregoing features can be implemented in different products and methods of fabrication.

A wire wound resistor arrangement including a plurality of wire wound resistors electrically connected in a series connection, a first terminal disposed at a first end of the series connection of wire wound resistors, and a second terminal disposed at a second end of the series connection of wire wound resistors. The wire wound resistors are arranged in a polygonal shape having at least three vertices the first terminal and the second terminal are disposed at one of the vertices.

Provided is a current detecting device comprising a current detecting resistor including a pair of electrodes and a resistive element; a pair of lands on which the current detecting resistor is adapted to be mounted; connection portions adapted to connect the two electrodes and the two lands, respectively; and a pair of wires connected to the two respective electrodes and adapted to detect a voltage. Positions where the two wires are connected to the two respective electrodes are located in regions on a further inner side than inner ends of the connection portions.

Provided is a current detecting device comprising a current detecting resistor including a pair of electrodes and a resistive element; a pair of lands on which the current detecting resistor is adapted to be mounted; connection portions adapted to connect the two electrodes and the two lands, respectively; and a pair of wires connected to the two respective electrodes and adapted to detect a voltage. Positions where the two wires are connected to the two respective electrodes are located in regions on a further inner side than inner ends of the connection portions.

A surge arrester has a resistance column which is pressed together by one or more clamping devices. The clamping devices are each fixed at both ends of the resistance column to an end fitting by way of a fixing device. An electrically insulating housing encloses the fixing device. Each end fitting has a first contour, on which the fixing devices are arranged and which is enclosed by the housing. The end fitting also has a second contour with a smaller diameter than the first contour.

A surge arrester has a resistance column which is pressed together by one or more clamping devices. The clamping devices are each fixed at both ends of the resistance column to an end fitting by way of a fixing device. An electrically insulating housing encloses the fixing device. Each end fitting has a first contour, on which the fixing devices are arranged and which is enclosed by the housing. The end fitting also has a second contour with a smaller diameter than the first contour.

A chip resistor including, a substrate having a main surface, a first resistance circuit formed at the main surface of the substrate, a second resistance circuit formed at the main surface of the substrate apart from the first resistance circuit, a common internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit and the second resistance circuit, a first internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit, a second internal electrode formed at the main surface of the substrate and electrically connected to the second resistance circuit, and a dummy resistance circuit formed in a region between the first resistance circuit and the second resistance circuit at the main surface of the substrate so as to be in an electrically floating state.

A chip resistor including, a substrate having a main surface, a first resistance circuit formed at the main surface of the substrate, a second resistance circuit formed at the main surface of the substrate apart from the first resistance circuit, a common internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit and the second resistance circuit, a first internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit, a second internal electrode formed at the main surface of the substrate and electrically connected to the second resistance circuit, and a dummy resistance circuit formed in a region between the first resistance circuit and the second resistance circuit at the main surface of the substrate so as to be in an electrically floating state.