Disclosed herein are embodiments of a scalable connection and disconnection differential surge limiter circuit that may be utilized in any AC-coupled transceiver. Charge is recycled between PADP and PADN using two diode paths, hence protecting the PAD connected devices from voltage stress. The circuit can act as a protection circuit to limit the voltage on PADP and PADN during differential voltage spikes.

Disclosed herein are embodiments of a scalable connection and disconnection differential surge limiter circuit that may be utilized in any AC-coupled transceiver. Charge is recycled between PADP and PADN using two diode paths, hence protecting the PAD connected devices from voltage stress. The circuit can act as a protection circuit to limit the voltage on PADP and PADN during differential voltage spikes.

An electrode system includes an electrode, a connector, and a cable with an in-line radio-frequency filter module comprising resistors and inductors without any deliberately added capacitance. The resistors are arranged in an alternating series of resistors and inductors, preferably with resistors at both outer ends, and connected electrically in series. The in-line module is located at a specific location along the wire, chosen through computer modeling and real-world testing for minimum transfer of received RF energy to a patient's skin, such as between 100 cm and 150 cm from the electrode end of a 240 centimeter cable. The total resistance of the resistors plus cable, connectors and solder is 1000 ohms or less; while the total inductance is roughly 1560 nanohenries. The inductors do not include ferrite or other magnetic material and are, together with the resistors, stock components thereby simplifying manufacture and reducing cost.

A micromechanical piezoresistive pressure sensor includes a diaphragm configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits, whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.

A micromechanical piezoresistive pressure sensor includes a diaphragm configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits, whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.

Disclosed is a thin-film micro-fuse assembly having: a substrate; an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor disposed on the insulating layer, the conductor forming: an inlet terminal, an outlet terminal and a fuse element between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.

Disclosed is a thin-film micro-fuse assembly having: a substrate; an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor disposed on the insulating layer, the conductor forming: an inlet terminal, an outlet terminal and a fuse element between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.

Provided are embodiments for a resistor array. The resistor array includes a plurality of resistor elements, where the plurality of resistor elements includes a redundancy region for a most significant bit of an expected value. The resistor array also includes one or more switches coupled to the plurality of resistor elements, and a first terminal and a second terminal coupled to the plurality of resistor elements. Also provided are embodiments for trimming the resistor array where the resistor array includes a redundancy region for a most significant bit for an expected value.

Provided are embodiments for a resistor array. The resistor array includes a plurality of resistor elements, where the plurality of resistor elements includes a redundancy region for a most significant bit of an expected value. The resistor array also includes one or more switches coupled to the plurality of resistor elements, and a first terminal and a second terminal coupled to the plurality of resistor elements. Also provided are embodiments for trimming the resistor array where the resistor array includes a redundancy region for a most significant bit for an expected value.

In a configuration for measuring a signal voltage by a voltage measuring unit through a multiplexer to which signals are inputted from a plurality of sensors including a thermistor, a series circuit which includes the thermistor, a driving resistor and a level shift resistor is connected between a power supply and the ground. A common connection point between the driving resistor and the level shift resistor is connected to an input terminal of the multiplexer.