A chip resistor element includes an insulating substrate, a resistor layer, first and second internal electrodes, a resistor protection layer, first and second electrode protection layers, and first and second external electrodes. The resistor layer is on the insulating substrate, the first and second internal electrodes are on respective sides of the resistor layer, and the resistor protection layer covers the resistor layer and extends onto portions of the internal electrodes. The first electrode protection layers are on the first and second internal electrodes so as to overlap with portions of the resistor protection layer and contain first conductive powder particles and resin, while the second electrode protection layers are disposed on the first electrode protection layers and contain second conductive powder particles and resin. A content of resin in the second electrode protection layer is lower than in the first electrode protection layer.

A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3.Math.mm/m2.Math.atm.Math.day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.

The method of making a flexible elastic conductive material for strain sensor and resistance applications using rubbing-in technology is shown. The thin rubber or any conductive material (substrates) is fixed at strained condition on the solid plate, by rubbing-in technology. Nanopowder of nanomaterials (organic semiconductors, carbon nanotubes, copper doped tin oxide, manganese doped tin oxide) at room temperature are embedded into the rubber conductive material to make built-in structure of conductive flexible elastic substrates that can be used for strain sensors, gages and resistance applications. The resultant product showed good sensitivity, stability and reliability during and after the rubbing-in operation.