A power resistor is disclosed, having at least one electrical connection, having a carrier substrate, which has at least one resistor element composed of a thick-film material and at least one contact electrode to which the resistor element electrically connects, having at least one electrical conductor, which is soldered to the contact electrode and produces an electrical connection between the contact electrode and the electrical terminal, and having a housing, which is at least partially filled with at least one casting compound and in which the resistor element and contact electrode are encapsulated, with the electrical conductor protruding out through the casting compound. In order to achieve a simply designed and easy-to-use power resistor, it is proposed for a pin, in particular a soldering pin or press-fitting pin, to constitute the electrical conductor, which pin is placed onto the contact electrode and soldered to it and constitutes the electrical terminal of the power resistor.

The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.

A resistive composition is provided to form thick film resistors on a substrate. The resistive composition includes platinum particles and ceramic particles. The ceramic particles include alumina particles. An organic vehicle can be included to form an ink or paste for thick film process. After application to the substrate, the resistive composition is fired to form the thick film resistors, which is fully adhered to the substrate.

A modulated inductance module includes an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element formed on a semiconductor die, wherein the inductor further has two or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout said ceramic element, the ceramic element has crystalline grain structure having a diameter that is less than or equal to 1.5× a mean grain diameter, and the semiconductor die contains active semiconductor switches or rectifying components that are in electrical communication with the one or more electrical conductors of the inductor.

A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.

There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, the conductive domains include a conjugated polymer and a dopant, and the number of structural units constituting the conjugated polymer is 65 or less.

The invention relates to a production method for an electrical resistance element (for example a shunt) with the following steps: —providing a resistance alloy in powder form, and—forming the resistance element from the powdered resistance material. The invention also relates to a correspondingly produced resistance element.

To provide a thick film resistor paste for a resistor having a smaller resistance change rate and excellent surge resistance, a thick film resistor using the thick film resistor paste, and an electronic component provided with the thick film resistor. A thick film resistor paste comprises an organic vehicle and a conductive substance-containing glass powder comprising ruthenium oxide and lead ruthenate, the conductive substance-containing glass powder comprises 10 to 70 mass% of conductive substances, a glass composition of the conductive substance-containing glass powder comprises 3 to 30 mass% of silicon oxide, 30 to 90 mass% of lead oxide, 5 to 50 mass% of boron oxide relative to 100 mass% of glass components, and, a combined amount of silicon oxide, lead oxide and boron oxide by mass% is 50 mass% or more relative to 100 mass% of the glass components.

The resistor 5 is a print-formed body including a meandering shaped first region 8 connected to the first front electrode 3 and a second region 9 connected to the first region 8 via a linking portion 10 and connected to the second front electrode 4. The first region 8 is provided with an I-cut shaped first trimming groove 11 and the second region 9 is provided with an L-cut shaped second trimming groove 12, and the side of the second region 9 positioned in the direction toward which a turn portion 12b of the second trimming groove 12 extends is an oblique side 9a that inclines to approach the second front electrode 4 as it approaches the connecting portion 7.