A composite circuit protection device includes: a first positive temperature coefficient (PTC) component; a first voltage-dependent resistor (VDR); a second VDR; and a plurality of conductive leads that correspondingly connect to the first PTC component, the first VDR and the second VDR. The second VDR and the first PTC component are electrically connected in series, the first VDR is electrically connected to the series connection of the first PTC component and the second VDR in parallel, and the first VDR has a varistor voltage greater than that of the second VDR as determined at 1 mA.

According to some aspects of the present disclosure, a temperature sensor assembly includes a thermistor including a first lead and a second lead, and a nonconductive separator defining at least two channels, with the first lead positioned in a first one of the channels and the second lead positioned in a second one of the channels to electrically isolate the first lead from the second lead. The assembly also includes a cable including a first conductor wire and a second conductor wire, with the first conductor wire coupled to the first lead and the second conductor wire coupled to the second lead, and a tube at least partially enclosing the thermistor, the nonconductive separator, and at least a portion of the cable. Methods for connecting thermistors to cables are also disclosed.

A PTC heating element has two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween. The PTC element is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element, and the metallization provided on the other of the main side surfaces is only assigned to the other potential for energizing the PTC element, as well as an electric heating device containing such a PTC heating element. With regard to better heat decoupling, the insulating layer may be glued to the PTC element, and the coating of the insulating layers is in direct electrically conductive contact with the metallization of the PTC element.

Structurally supported positive temperature coefficient (PTC) materials are disclosed. Furthermore, methods to provide structurally supported PTC materials are disclosed. In one implementation, a structurally supported PTC material includes a support structure that is at least partially covered by a PTC material. In one example, the support structure is a mesh material integrated at least partially in the PTC material.

Structurally supported positive temperature coefficient (PTC) materials are disclosed. Furthermore, methods to provide structurally supported PTC materials are disclosed. In one implementation, a structurally supported PTC material includes a support structure that is at least partially covered by a PTC material. In one example, the support structure is a mesh material integrated at least partially in the PTC material.

A protection device comprises a resin base, PTC component, bimetal component, arm and upper plate which are housed in a resin housing wherein the base includes a terminal integrated with the base by insert molding. A resin cover is formed by insert molding to cover the PTC component, bimetal component, arm and upper plate which are superposed in this order over the terminal within a space in the base. The space in the resin base is substantially closed by the upper plate, the base and the cover are integrally bonded to define the resin housing, the terminal and the arm are electrically connected in series in a normal state, and in an abnormal state where the bimetal component is activated, the terminal and the arm are electrically cut off, while the terminal, PTC component, bimetal component, and arm are electrically connected in series in this order.

A protection device comprises a resin base, PTC component, bimetal component, arm and upper plate which are housed in a resin housing wherein the base includes a terminal integrated with the base by insert molding. A resin cover is formed by insert molding to cover the PTC component, bimetal component, arm and upper plate which are superposed in this order over the terminal within a space in the base. The space in the resin base is substantially closed by the upper plate, the base and the cover are integrally bonded to define the resin housing, the terminal and the arm are electrically connected in series in a normal state, and in an abnormal state where the bimetal component is activated, the terminal and the arm are electrically cut off, while the terminal, PTC component, bimetal component, and arm are electrically connected in series in this order.

An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage.

A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.

A circuit protection device including a PTC device having a PTC element, first and second electrodes disposed on opposing first and second surfaces of the PTC element, respectively, first and second chip fuses disposed on the first and second electrodes, respectively, the second chip fuse electrically connected in series with the PTC device, and the first chip fuse electrically in connected parallel with the PTC device and the second chip fuse, the first chip fuse having a lower electrical resistance than the PTC element when the PTC element is in a non-tripped state, wherein a fusible element of the first chip fuse has a first melting temperature and is configured to carry a current higher than the PTC element can carry without tripping, and wherein a fusible element of the second chip fuse has a second melting temperature that is greater than the first melting temperature.