An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.

An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.

A polymer positive temperature coefficient (PPTC) material is provided. The PPTC material may include a polymer matrix that defines a PPTC body, and further includes a high temperature polymer. The PPTC material may include a conductive filler component, disposed in the polymer matrix, an arc suppressant, and a high temperature antioxidant, disposed in the polymer matrix.

In one embodiment, an apparatus is attached to a feature to be deployed on a satellite. The apparatus includes a first material having an impedance, a second material coupled to the first material configured to provide a current or voltage to the first material causing the first material to generate heat based on the impedance after a launch process of a launch vehicle carrying the satellite has completed, and a third material configured to change state at a transition temperature. A release mechanism is coupled to the third material and holds the feature in an undeployed position on the satellite. The heat generated by the second material causes the third material to change state when the transition temperature range is reached and the release mechanism is released from the third material when the third material is in the second state to deploy the feature.

In one embodiment, an apparatus is attached to a feature to be deployed on a satellite. The apparatus includes a first material having an impedance, a second material coupled to the first material configured to provide a current or voltage to the first material causing the first material to generate heat based on the impedance after a launch process of a launch vehicle carrying the satellite has completed, and a third material configured to change state at a transition temperature. A release mechanism is coupled to the third material and holds the feature in an undeployed position on the satellite. The heat generated by the second material causes the third material to change state when the transition temperature range is reached and the release mechanism is released from the third material when the third material is in the second state to deploy the feature.

A method of forming a positive temperature coefficient (PTC) device, the method including providing a core formed of a PTC material, the core having an electrode disposed on a first surface thereof and a second electrode disposed on a second surface thereof, connecting a first lead element to the first electrode, applying an oxygen barrier epoxy to at least portions of the core, the first electrode, the second electrode, and the first lead element, and curing the oxygen barrier epoxy to form an oxygen barrier package surrounding at least portions of the core, the first electrode, the second electrode, and the first lead element.

A method of forming a positive temperature coefficient (PTC) device, the method including providing a core formed of a PTC material, the core having an electrode disposed on a first surface thereof and a second electrode disposed on a second surface thereof, connecting a first lead element to the first electrode, applying an oxygen barrier epoxy to at least portions of the core, the first electrode, the second electrode, and the first lead element, and curing the oxygen barrier epoxy to form an oxygen barrier package surrounding at least portions of the core, the first electrode, the second electrode, and the first lead element.

A shunt resistor, at least a part of which has a resistive element with pre-set resistivity, is configured to bridge between two electrodes and detect a current value of a current flowing between the electrodes by detecting a voltage drop in the resistive element. The shunt resistor includes two connecting parts affixed to the electrodes via a conductive adhesive, respectively, and the connecting parts electrically connected to the affixed electrodes, a bridging part bridging between the connecting parts by being extended from one of the connecting parts to the other one of the connecting parts, and two bonding wires used to detect a voltage drop in the resistive element. The two bonding wires are extracted parallel to an extension direction of the bridging part to a same direction.

A shunt resistor, at least a part of which has a resistive element with pre-set resistivity, is configured to bridge between two electrodes and detect a current value of a current flowing between the electrodes by detecting a voltage drop in the resistive element. The shunt resistor includes two connecting parts affixed to the electrodes via a conductive adhesive, respectively, and the connecting parts electrically connected to the affixed electrodes, a bridging part bridging between the connecting parts by being extended from one of the connecting parts to the other one of the connecting parts, and two bonding wires used to detect a voltage drop in the resistive element. The two bonding wires are extracted parallel to an extension direction of the bridging part to a same direction.

A protection device comprises a first planar substrate, a second planar substrate, a heating element, a fusible element and an absorbent element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The heating element is disposed on the first surface, and the fusible element is disposed above the heating element. The absorbent element is disposed on the second surface and above the fusible element. When over-current or over-temperature occurs, the heating element heats up to melt and blow the fusible element and the absorbent element absorbs melted metal of the fusible element.