H01C7/18

MULTILAYER CERAMIC ELECTRONIC COMPONENT
20170309402 · 2017-10-26 ·

A multilayer ceramic electronic component has a dimension in a longitudinal direction of no less than about 0.12 mm and no more than about 0.27 mm, a dimension in a width direction of no less than about 0.06 mm and no more than about 0.14 mm, and a dimension in a lamination direction of no less than about 0.06 mm and no more than about 0.14 mm, for example. Each of a first outer electrode and a second outer electrode includes an underlying electrode layer disposed on a surface of a multilayer body, a nickel-plated layer covering the underlying electrode layer, and a tin-plated layer covering the nickel-plated layer. The nickel-plated layer in each of the first outer electrode and second outer electrode has surface roughness of no less than about 3 μm and no more than about 6 μm, for example.

Electrical component having layered structure with improved breakdown performance
11670453 · 2023-06-06 · ·

An electrical component having a layered structure including first and second electrodes each having first and second electrode portions located in a plane and at least partially embedded in a dielectric body, each of the first and second electrode portions separated by a gap and substantially isolated by the dielectric, the first electrode substantially parallel to and at least partially overlapping the second electrode, wherein the first and second electrodes are electrically isolated and separated by the dielectric body.

ELECTRICAL COMPONENT, COMPONENT ARRANGEMENT, AND A METHOD FOR PRODUCING AN ELECTRICAL COMPONENT AND COMPONENT ARRANGEMENT
20170290164 · 2017-10-05 · ·

An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

Electrical multilayer component
09779859 · 2017-10-03 · ·

An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane.

Electrical multilayer component
09779859 · 2017-10-03 · ·

An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane.

VOLTAGE-NONLINEAR RESISTOR ELEMENT AND METHOD FOR PRODUCING THE SAME

A voltage-nonlinear resistor element 10 includes a voltage-nonlinear resistor (referred simply as “resistor”) 20 and a pair of electrodes 14 and 16 between which the resistor 20 is interposed. The resistor 20 has a multilayer structure including a first layer 21 composed primarily of zinc oxide, a second layer 22 composed primarily of zinc oxide, and a third layer 23 composed primarily of a metal oxide other than zinc oxide. The second layer 22 is adjacent to the first layer 21 and has a smaller thickness and a higher volume resistivity than the first layer 21. The third layer 23 is adjacent to the second layer 22.

VOLTAGE-NONLINEAR RESISTOR ELEMENT AND METHOD FOR PRODUCING THE SAME

A voltage-nonlinear resistor element 10 includes a voltage-nonlinear resistor (referred simply as “resistor”) 20 and a pair of electrodes 14 and 16 between which the resistor 20 is interposed. The resistor 20 has a multilayer structure including a first layer 21 composed primarily of zinc oxide, a second layer 22 composed primarily of zinc oxide, and a third layer 23 composed primarily of a metal oxide other than zinc oxide. The second layer 22 is adjacent to the first layer 21 and has a smaller thickness and a higher volume resistivity than the first layer 21. The third layer 23 is adjacent to the second layer 22.

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

MULTILAYER ELECTRONIC COMPONENT PRODUCTION METHOD

A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

MULTILAYER ELECTRONIC COMPONENT PRODUCTION METHOD

A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.