A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.

Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.

A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

Systems and methods for generating a compressive pre-load in a resistive touch center through the lamination of differently curved surfaces. The system comprising a processor; and a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations, comprising: determining a first curvature of a rigid back layer comprising a grouping of sensor electrodes; determining a second curvature of a flexible surface layer; and as a function of the first curvature and the second curvature facilitating lamination of the flexible surface layer to the rigid back layer.

A light adjusting device includes a housing, a light adjusting assembly and a circuit switching mechanism. The circuit switching mechanism is connected to the light adjusting assembly. The light adjusting assembly can be in communication with a first circuit and a second circuit respectively by means of the circuit switching mechanism, so as to control light-emitting elements in the first and second circuits by one light adjusting device.

A pressure sensor formed in a sheet type is provided, including conductive fibers, nonconductive fibers, and piezoresistive fibers, which are woven together, wherein the pressure sensor includes a first electrode layer including the conductive fibers and the nonconductive fibers, a second electrode layer including the conductive fibers and the nonconductive fibers, and a piezoresistive layer including the piezoresistive fibers and disposed between the first electrode layer and the second electrode layer.

A pressure sensor includes a variable resistance portion, and a first electrode and a second electrode. The variable resistance portion includes a conductive foam elastomer material. When pressure is applied to the variable resistance portion, the variable resistance portion is compressed in accordance with the pressure. As the compression amount increases, the electric resistance of the variable resistance portion decreases. The first electrode and the second electrode are configured to contact with the variable resistance portion at a location having an interval of 0.5 mm or greater with each other, therefore being electrically connected via the variable resistance portion.

A pressure sensor includes a variable resistance portion, and a first electrode and a second electrode. The variable resistance portion includes a conductive foam elastomer material. When pressure is applied to the variable resistance portion, the variable resistance portion is compressed in accordance with the pressure. As the compression amount increases, the electric resistance of the variable resistance portion decreases. The first electrode and the second electrode are configured to contact with the variable resistance portion at a location having an interval of 0.5 mm or greater with each other, therefore being electrically connected via the variable resistance portion.