The invention relates to a switch for an electrical device, in particular for an electrical tool, comprising a slide control (20) for setting a rotational speed of the electrical device, a switch housing, and at least one circuit board (30) arranged in the switch housing for holding electrical components of the slide control. According to the invention, a movably supported operating element (21.4) of the slide control is inserted into a contact chamber (12) of the switch housing in a sealed manner through a first feed-through (11) and is led out of the contact chamber in a sealed manner through a second feed-through (44.1) in all adjustment positions of the operating element. Thus, a switch that ensures reliable function even under ambient conditions of high contamination is provided.

The invention relates to a switch for an electrical device, in particular for an electrical tool, comprising a slide control (20) for setting a rotational speed of the electrical device, a switch housing, and at least one circuit board (30) arranged in the switch housing for holding electrical components of the slide control. According to the invention, a movably supported operating element (21.4) of the slide control is inserted into a contact chamber (12) of the switch housing in a sealed manner through a first feed-through (11) and is led out of the contact chamber in a sealed manner through a second feed-through (44.1) in all adjustment positions of the operating element. Thus, a switch that ensures reliable function even under ambient conditions of high contamination is provided.

A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO.sub.2, TiN, TiNO and TiSiON.

A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO.sub.2, TiN, TiNO and TiSiON.

Stacks of electrically resistive materials and related apparatuses, electrical systems, and methods are disclosed. An apparatus includes one or more resistor devices including a substrate, first and second electrically resistive materials, and an electrically insulating material between the first and second electrically resistive materials. The substrate includes a semiconductor material. A stepped trench is defined in the substrate by sidewalls and horizontal surfaces of the semiconductor material. The first electrically resistive material and the second electrically resistive material are within the stepped trench. A method of manufacturing a resistor device includes forming a stepped trench in the substrate, forming an etch stop material within the stepped trench, disposing an electrically resistive material within the stepped trench, disposing an electrically insulating material on the electrically resistive material, and repeating the disposing the electrically resistive material and the disposing the electrically insulating material operations a predetermined number of times.

System and method for providing precision a self calibrating resistance circuit is described that provides for matching a reference resistor using dynamically configurable resistance networks. The resistor network is coupled to the connection, wherein the resistor network provides a configurable resistance across the connection. In addition, the resistor network comprises a digital resistor network and an analog resistor network. Also, the circuit includes control circuitry for configuring the configurable resistance based on a reference resistance of the reference resistor. The configurable resistance is configured by coarsely tuning the resistor network through the digital resistor network and fine tuning the resistor network through the analog resistor network.

System and method for providing precision a self calibrating resistance circuit is described that provides for matching a reference resistor using dynamically configurable resistance networks. The resistor network is coupled to the connection, wherein the resistor network provides a configurable resistance across the connection. In addition, the resistor network comprises a digital resistor network and an analog resistor network. Also, the circuit includes control circuitry for configuring the configurable resistance based on a reference resistance of the reference resistor. The configurable resistance is configured by coarsely tuning the resistor network through the digital resistor network and fine tuning the resistor network through the analog resistor network.

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

A high-energy resistor has a resistive body comprising unbound particulate material. The resistance value of the resistor can be determined in part by a mixing ratio of components in the unbound particulate material and a pressure applied to the particulate material. For a selected mixing ratio, the resistance of the assembled resistor can be adjusted to obtain a selected resistance value with high accuracy by changing pressure on the unbound particulate material. Such adjustment can be made readily by a user before and/or after the resistor is installed in a system. The adjustment can be automated and made during operation of the system to maintain a resistance value precisely.

A high-energy resistor has a resistive body comprising unbound particulate material. The resistance value of the resistor can be determined in part by a mixing ratio of components in the unbound particulate material and a pressure applied to the particulate material. For a selected mixing ratio, the resistance of the assembled resistor can be adjusted to obtain a selected resistance value with high accuracy by changing pressure on the unbound particulate material. Such adjustment can be made readily by a user before and/or after the resistor is installed in a system. The adjustment can be automated and made during operation of the system to maintain a resistance value precisely.