Patent classifications
H01C13/02
LOAD RESISTOR
[Problem] To provide a load resistor: which has arranged therein a plurality of resistant rods that generate heat only to about 100° C. or less due to power supply from an emergency power generator, for example, and that rapidly lose the heat by mere exposure to the air; and which, therefore, does not need a cooling device to be installed for forcibly cooling the resistant rods, or a cooling fan that would be extremely heavy, have a large capacity, and end up accounting for about half of the ;eight and about the lower half of the volume constituting the load resistor. [Solution] The present invention is a load resistor that receives power transmitted from an apparatus and performs an energization test on the apparatus. The load resistor is characterized by comprising a rod-shaped resistive base body that is energized with the power and generates heat, a pipe-shaped protective member through which the rod-shaped resistive base body penetrates, and rod-shaped resistors having an insulation member that are packed in between the rod-shaped resistive base body and the protective member, the rod-shaped resistive base body having used therein a stretched nichrome wire that is wound in the shape of a coil.
Chip resistor and electronic equipment having resistance circuit network
A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
Chip resistor and electronic equipment having resistance circuit network
A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
STACKS OF ELECTRICALLY RESISTIVE MATERIALS AND RELATED SYSTEMS, METHODS, AND APPARATUSES
Stacks of electrically resistive materials and related apparatuses, electrical systems, and methods are disclosed. An apparatus includes one or more resistor devices including a substrate, first and second electrically resistive materials, and an electrically insulating material between the first and second electrically resistive materials. The substrate includes a semiconductor material. A stepped trench is defined in the substrate by sidewalls and horizontal surfaces of the semiconductor material. The first electrically resistive material and the second electrically resistive material are within the stepped trench. A method of manufacturing a resistor device includes forming a stepped trench in the substrate, forming an etch stop material within the stepped trench, disposing an electrically resistive material within the stepped trench, disposing an electrically insulating material on the electrically resistive material, and repeating the disposing the electrically resistive material and the disposing the electrically insulating material operations a predetermined number of times.
MODULAR, HIGH DENSITY, LOW INDUCTANCE, MEDIA COOLED RESISTOR
A resistor includes a first resistor element. The first resistor element is connected to at least a first electrical terminal and a second electrical terminal. The first resistor element is configured to directly contact cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element. The resistor may also include a second resistor element connected to at least the first electrical terminal and the second electrical terminal, where the second resistor element is configured to directly contact the cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.
MODULAR, HIGH DENSITY, LOW INDUCTANCE, MEDIA COOLED RESISTOR
A resistor includes a first resistor element. The first resistor element is connected to at least a first electrical terminal and a second electrical terminal. The first resistor element is configured to directly contact cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element. The resistor may also include a second resistor element connected to at least the first electrical terminal and the second electrical terminal, where the second resistor element is configured to directly contact the cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.
HIGH VOLTAGE (HV) IMPEDANCE DEVICE WITH SURFACE LEAKAGE PROOF CONFIGURATION APPLIED IN HV DIVIDER
A high voltage impedance device with surface leakage proof configuration is applied in a divider. Aforementioned divider is assembled by a high impedance element, an inner case body and an outer case body. The high impedance element is sealed in the inner case body and a closed interlayer between the inner case body and the outer case body is filled with noble gas as an insulating layer. While the high impedance element is applied in high voltage, the closed interlayer can prevent the current-leakage from forming impedance paralleled with the high impedance element. The current-leakage is formed on the surface of insulting portion, or is formed by moisture, dust or corona effect. Therefore, the current-leakage proof divider may maintain the stability/linearity of the voltage division and then reduce the distance between two ends of the high impedance element effectively and still maintain the linearity of measuring voltage.
Chip parts
A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.
COMPONENT SHEET AND METHOD OF SINGULATING
A sheet of electronic components includes a plurality of electronic components. A plurality of connecting members mechanically connects the electronic components together. A first fiducial marker is located at a first predetermined location on the sheet and a second fiducial marker is located at a second predetermined location on the sheet.
Resistance assembly for mobile device and manufacturing method thereof
A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.