A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580 C. to 760 C. This chip resistor prevents the resistive element from being peeled off.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a housing, where the housing includes at least one housing wall having at least one aperture, and where the housing encloses at least a portion of the resistor and at least a portion of the shield cup. A volume of space between the at least one housing wall of the housing and the resistor can be substantially filled with an insulating material and at least the outside of the housing is substantially covered with the insulating material.

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

An assembled heatable media line having a media line having at least two heating elements arranged on the exterior of the media line and at least one line connector. In order to heat the at least one line connector, only one of the heating elements is arranged at or on said line connector and at least partially surrounds the same.

An assembled heatable media line having a media line having at least two heating elements arranged on the exterior of the media line and at least one line connector. In order to heat the at least one line connector, only one of the heating elements is arranged at or on said line connector and at least partially surrounds the same.

A device for measuring current intensities including a resistor arrangement, the resistor arrangement having at least two connection elements, at least one resistor element arranged between the connection elements, and at least one contact pin monolithically connected to one of the connection elements and being formed out of the material of the connection element. The device also includes a printed circuit board mechanically and electrically connected to the resistor arrangement, which printed circuit board has a side facing away from the resistor arrangement. The printed circuit board also includes at least one conductor track and at least one passage bore. The at least one contact pin of the resistor arrangement extends through the passage bore and has, on the side of the printed circuit board facing away from the resistor arrangement, a lateral widening. The lateral widening mechanically fixes the printed circuit board to the resistor arrangement.

A device for measuring current intensities including a resistor arrangement, the resistor arrangement having at least two connection elements, at least one resistor element arranged between the connection elements, and at least one contact pin monolithically connected to one of the connection elements and being formed out of the material of the connection element. The device also includes a printed circuit board mechanically and electrically connected to the resistor arrangement, which printed circuit board has a side facing away from the resistor arrangement. The printed circuit board also includes at least one conductor track and at least one passage bore. The at least one contact pin of the resistor arrangement extends through the passage bore and has, on the side of the printed circuit board facing away from the resistor arrangement, a lateral widening. The lateral widening mechanically fixes the printed circuit board to the resistor arrangement.

Disclosed are a preparation process and an automatic filling apparatus for ceramic slurry of an explosion-proof thermistor. The automatic filling apparatus includes a slurry stirring and conveying device, a ceramic housing arranging and conveying device, a primary filling mechanism, a secondary filling mechanism, and a chip inserting mechanism, where the primary filling mechanism and the secondary filling mechanism are arranged at a left end and a right end of the ceramic housing arranging and conveying device respectively, the chip inserting mechanism is arranged between the primary filling mechanism and the secondary filling mechanism, and the slurry stirring and conveying device is connected to the primary filling mechanism and the secondary filling mechanism. The present automatic filling apparatus realizes streamlined continuous filling of the ceramic slurry of the explosion-proof thermistor. Accordingly, a filling efficiency of the explosion-proof thermistor is improved.