A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

An electrical resistor has a resistance conductor, which is applied to a carrier layer, and two connection elements, which are electrically conductively connected to the resistance conductor. The two connection elements are configured to each be welded or soldered to an electrical contact in order to electrically contact the resistor. The resistance conductor for each connection element has a region that overlaps the corresponding connection element. The overlap region is in electrical contact with the corresponding connection element.

An electrical resistor has a resistance conductor, which is applied to a carrier layer, and two connection elements, which are electrically conductively connected to the resistance conductor. The two connection elements are configured to each be welded or soldered to an electrical contact in order to electrically contact the resistor. The resistance conductor for each connection element has a region that overlaps the corresponding connection element. The overlap region is in electrical contact with the corresponding connection element.

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

Structurally supported positive temperature coefficient (PTC) materials are disclosed. Furthermore, methods to provide structurally supported PTC materials are disclosed. In one implementation, a structurally supported PTC material includes a support structure that is at least partially covered by a PTC material. In one example, the support structure is a mesh material integrated at least partially in the PTC material.

Structurally supported positive temperature coefficient (PTC) materials are disclosed. Furthermore, methods to provide structurally supported PTC materials are disclosed. In one implementation, a structurally supported PTC material includes a support structure that is at least partially covered by a PTC material. In one example, the support structure is a mesh material integrated at least partially in the PTC material.

A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.

In order to provide a resin composition for temperature sensors that includes a polymer and exhibits high flexibility, higher sensitivity and high cyclic repeatability, a temperature sensor element, a temperature sensor, and a method for producing a temperature sensor, the resin composition (10) for temperature sensors is configured to have conductive particles (2) dispersed in an acrylic polymer (1) obtained by copolymerizing a first acrylic monomer represented by a general formula CH.sub.2CHCOOX.sub.1 and a second acrylic monomer represented by a general formula CH.sub.2CHCOOX.sub.2.

In order to provide a resin composition for temperature sensors that includes a polymer and exhibits high flexibility, higher sensitivity and high cyclic repeatability, a temperature sensor element, a temperature sensor, and a method for producing a temperature sensor, the resin composition (10) for temperature sensors is configured to have conductive particles (2) dispersed in an acrylic polymer (1) obtained by copolymerizing a first acrylic monomer represented by a general formula CH.sub.2CHCOOX.sub.1 and a second acrylic monomer represented by a general formula CH.sub.2CHCOOX.sub.2.