In a manufacturing method for a thermistor element (3) including: a thermistor portion (49) which is a sintered body formed from a thermistor material; and a pair of electrode wires (25) which are embedded in the thermistor portion (49) and at least one end portion of each of the electrode wires projects at an outer side of the thermistor portion (49), the resistance value of the thermistor element (3) is adjusted by performing a removal processing of removing a part of the thermistor portion (49).

Provided are a resistor that is compact, highly accurate, and highly reliable, a method of manufacturing the same, and a device including the resistor. A resistor (10) includes: an insulating substrate (1); a terminal electrode (2) formed on the insulating substrate (1); a bottom electrode (3) that is formed on the insulating substrate (1), is connected to the terminal electrode (2), and has a resistance adjustment pattern (43), and in which a portion thereof that is closer to the terminal electrode (2) has lower resistance than a portion thereof that is farther from the terminal electrode (2); a resistance body (6) formed on the bottom electrode (3); and a top electrode (7) that is formed on the resistance body (6) and is disposed opposite to the bottom electrode (3).

The present invention provides an amplifier circuit, wherein the amplifier circuit includes an operational amplifier and a feedback path. The operational amplifier has an input terminal and an output terminal, and is arranged for receiving an input signal to generate an output signal. The feedback path is coupled between the input terminal and the output terminal of the operational amplifier, wherein the feedback path comprises at least two poly resistors, and a depletion region of at least one of the two poly resistors is biased by the output signal generated by the operational amplifier.

A resistive element including a main body portion, and first and second terminal portions with different shapes that are provided at opposite ends of the main body portion in the long-side direction. At least one side portion of the main body portion in the short-side direction has a protruding portion.

A resistive element including a main body portion, and first and second terminal portions with different shapes that are provided at opposite ends of the main body portion in the long-side direction. At least one side portion of the main body portion in the short-side direction has a protruding portion.

A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 m and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.

A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 m and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.

A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (CuMnSn) alloy. In the CuMnSn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%.

A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (CuMnSn) alloy. In the CuMnSn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%.

A shunt resistor according to the present invention includes a pair of electrode plates spaced apart from each other in a plate surface direction and a resistive alloy plate that connects the pair of electrode plates and that has a predetermined set resistance value. A surface of the resistive alloy plate is provided with a visually recognizable character string pattern that is formed by laser processing and that indicates the set resistance value of the resistive alloy plate, and a surface area and a carving depth of the character string pattern are set in such a manner that the resistive alloy plate has the set resistance value.