A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.

Provided is a method for producing a resistor, including a step of forming a through-hole in a sheet-like conductive material; a step of fitting a resistive element piece into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed by the through-hole; and stamping a region including the joint portions from the conductive material, thereby forming a resistor including a resistive element and a pair of electrodes.

Provided is a method for producing a resistor, including a step of forming a through-hole in a sheet-like conductive material; a step of fitting a resistive element piece into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed by the through-hole; and stamping a region including the joint portions from the conductive material, thereby forming a resistor including a resistive element and a pair of electrodes.

Provided is a sensor including a first bus bar, a second bus bar, and a shunt resistor including a shunt resistor body part whose one end portion is bonded to the first bus bar and the other end portion is bonded to the second bus bar and a detection terminal extending from the shunt resistor body part.

Provided is a sensor including a first bus bar, a second bus bar, and a shunt resistor including a shunt resistor body part whose one end portion is bonded to the first bus bar and the other end portion is bonded to the second bus bar and a detection terminal extending from the shunt resistor body part.

A thin film resistor formed using thermal spraying techniques in the manufacturing process is provided. A thin film resistor and method of manufacturing a thin film resistor are disclosed including a thermally sprayed resistive element. An alloy bond layer may be applied to a substrate and a thermally sprayed resistive layer is applied to the alloy bond layer by a thermal spraying process to form a thermally sprayed resistive element. The alloy bond layer and the thermally sprayed resistive layer may have the same chemical composition.

A method of manufacturing an electronic component includes manufacturing a ceramic element including one pair of end surfaces and four side surfaces, forming external electrodes at both end portions of the ceramic element, measuring an initial characteristic value, determining any side surface to be machined among the four side surfaces and then determining, based on stored data, an amount of machining to be performed on the side surface to be machined, and machining, by the determined machining amount, the side surface of the ceramic element, which is determined to be machined, to be flush or substantially flush with the external electrodes.

The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.

A noise-preventing resistor has a structure in which a resistance wire is wound around an outer circumferential surface of a core, cap terminals are attached to either end part of the core, and part of an insulative coating (resin coating) covering the resistance wire and part of the resistance wire positioned underneath the insulative coating are cut, forming peeled regions exposing the resistance wire. As a result, conduction between the cap terminals and the resistance wire in the noise-preventing resistor is ensured.

A noise-preventing resistor has a structure in which a resistance wire is wound around an outer circumferential surface of a core, cap terminals are attached to either end part of the core, and part of an insulative coating (resin coating) covering the resistance wire and part of the resistance wire positioned underneath the insulative coating are cut, forming peeled regions exposing the resistance wire. As a result, conduction between the cap terminals and the resistance wire in the noise-preventing resistor is ensured.