The present invention relates to a chip resistor. A method of manufacturing a chip resistor comprising steps of: preparing an insulating substrate squarely segmented with vertical slits and horizontal slits, applying on the insulating substrate a conductive paste crossing over the horizontal slits, applying a resistor paste on the insulating substrate, forming trimming grooves to adjust resistivity of the resistor layers, and splitting the insulating substrate to form chip resistors, wherein the conductive paste comprises (i) a conductive powder comprising an agglomerated metal powder, wherein particle diameter (D50) of the agglomerated metal powder is 3 to 12 m and specific surface area (SA) of the agglomerated metal powder is 3.1 to 8.0 m.sup.2/g, (ii) a glass frit and (iii) an organic vehicle.

Disclosed is a method for improving anti-reduction performance of a PTC thermosensitive element, including coating an inorganic protective layer, organic protective layer, or organic and inorganic composite protective layer coated with a mixture of an inorganic substance and an organic substance for blocking harmful reducing gases from entering an interior of a ceramic body through surface defects or grain boundaries of the ceramic body onto the surface of a PTC thermosensitive element based on barium lead titanate. Advantages: by coating the inorganic protective layer, organic protective layer, or organic and inorganic composite protective layer coated with the mixture of the inorganic substance and the organic substance onto the surface of the PTC thermosensitive element based on barium lead titanate to form an isolation protective layer for blocking reducing harmful gases from entering the interior of the ceramic body through the surface defects or grain boundaries of the ceramic body.

Disclosed is a method for improving anti-reduction performance of a PTC thermosensitive element, including coating an inorganic protective layer, organic protective layer, or organic and inorganic composite protective layer coated with a mixture of an inorganic substance and an organic substance for blocking harmful reducing gases from entering an interior of a ceramic body through surface defects or grain boundaries of the ceramic body onto the surface of a PTC thermosensitive element based on barium lead titanate. Advantages: by coating the inorganic protective layer, organic protective layer, or organic and inorganic composite protective layer coated with the mixture of the inorganic substance and the organic substance onto the surface of the PTC thermosensitive element based on barium lead titanate to form an isolation protective layer for blocking reducing harmful gases from entering the interior of the ceramic body through the surface defects or grain boundaries of the ceramic body.

The invention relates to a method for producing a surge arrester, comprising the steps of: providing a module 1 comprising one or more varistor blocks 3 and two end armatures 5; introducing the module 1 into a mould 7 in order to form a housing 21; evacuating the mould 7 in a vacuum chamber 9; introducing liquid silicone 11 into the evacuated mould 7 in the vacuum chamber 9; baking the mould 7 in order to crosslink the silicone 11; and removing the surge arrester from the mould 7.

The invention relates to a method for producing a surge arrester, comprising the steps of: providing a module 1 comprising one or more varistor blocks 3 and two end armatures 5; introducing the module 1 into a mould 7 in order to form a housing 21; evacuating the mould 7 in a vacuum chamber 9; introducing liquid silicone 11 into the evacuated mould 7 in the vacuum chamber 9; baking the mould 7 in order to crosslink the silicone 11; and removing the surge arrester from the mould 7.

In a method of manufacturing a resistor, a sheet-shaped resistive element having formed thereon a plurality of belt-shaped electrodes is cut in a direction crossing these belt-shaped electrodes to produce strip-shaped resistive elements. On the other hand, a metal paste containing a glass frit is printed in a pattern of belts arranged at regular intervals on a surface of a plate-shaped insulating substrate to form a plurality of adhesive layers. Then, the strip-shaped resistive elements are respectively applied to the adhesive layers on the plate-shaped insulating substrate, and these are fired in a nitrogen atmosphere. After firing, while a resistance value of a part between each adjacent two electrodes of each strip-shaped resistive element is measured, the strip-shaped resistive element is trimmed so that the resistance value becomes a predetermined value. Then, the plate-shaped insulating substrate having adhered thereto the strip-shaped resistive elements is divided into pieces.

In a method of manufacturing a resistor, a sheet-shaped resistive element having formed thereon a plurality of belt-shaped electrodes is cut in a direction crossing these belt-shaped electrodes to produce strip-shaped resistive elements. On the other hand, a metal paste containing a glass frit is printed in a pattern of belts arranged at regular intervals on a surface of a plate-shaped insulating substrate to form a plurality of adhesive layers. Then, the strip-shaped resistive elements are respectively applied to the adhesive layers on the plate-shaped insulating substrate, and these are fired in a nitrogen atmosphere. After firing, while a resistance value of a part between each adjacent two electrodes of each strip-shaped resistive element is measured, the strip-shaped resistive element is trimmed so that the resistance value becomes a predetermined value. Then, the plate-shaped insulating substrate having adhered thereto the strip-shaped resistive elements is divided into pieces.

A method comprising: forming a polyimide layer; forming a thin film resistor on the polyimide layer; forming, on the thin film resistor and the polyimide layer, a metallization layer that includes metal contacts on opposing ends of the thin film resistor but leaves an exposed surface of the polyimide layer; baking the polyimide layer, the thin film resistor, and the metallization layer to remove water from the polyimide layer; forming, on the exposed surface of the polyimide layer, a hydrophobic moisture barrier layer that prevents absorption of water into the polyimide layer to avoid blistering of the thin film resistor during subsequent laser trimming of the thin film resistor; and laser trimming a resistance of the thin film resistor between the metal contacts.

A method comprising: forming a polyimide layer; forming a thin film resistor on the polyimide layer; forming, on the thin film resistor and the polyimide layer, a metallization layer that includes metal contacts on opposing ends of the thin film resistor but leaves an exposed surface of the polyimide layer; baking the polyimide layer, the thin film resistor, and the metallization layer to remove water from the polyimide layer; forming, on the exposed surface of the polyimide layer, a hydrophobic moisture barrier layer that prevents absorption of water into the polyimide layer to avoid blistering of the thin film resistor during subsequent laser trimming of the thin film resistor; and laser trimming a resistance of the thin film resistor between the metal contacts.

To provide a manufacturing method for a laminated ceramic component capable of forming an external electrode with a suppressed moon shape. The manufacturing method for the laminated ceramic component includes a first step, a second step, a third step, a fourth step, and a fifth step. In the first step, a laminate that a plurality of ceramic green sheets and a plurality of internal electrode paste layers are laminated is prepared. In the second step, the laminate is fired to form a ceramic element body. In the third step, plasma treatment is performed on a surface of the ceramic element body. In the fourth step, an external electrode paste is attached to a part of the surface of the ceramic element body after the third step. In the fifth step, the ceramic element body after the fourth step is subjected to the heat treatment to form an external electrode.