An inductor for use in an aerosol provision device. The inductor includes an electrically-conductive element. The element includes an electrically-conductive non-spiral first portion coincident with a first plane, an electrically-conductive non-spiral second portion coincident with a second plane that is spaced from the first plane, and an electrically-conductive connector that electrically connects the first portion to the second portion.

An electronic device is provided. The electronic device includes a housing structure including a first surface facing in a first direction and a second surface facing in a second direction opposite to the first direction, a display unit disposed at the first surface, a printed circuit board disposed inside the housing structure, a first coil disposed between the printed circuit board and the second surface and electrically connected to the printed circuit board and including a first pattern wound one or more times about a first axis parallel to the second direction, and a second coil disposed between the printed circuit board and the second surface and electrically connected to the printed circuit board and including a second pattern wound one or more times about a second axis parallel to the second direction.

A position sensor includes a flexible substrate formed into a three-dimensional (3D) shape. At least first and second field-sensing coils are formed in first and second respective layers of the flexible substrate, such that in the 3D shape the first and second field-sensing coils have first and second respective axes that are not parallel to one another.

An electronic component includes an antenna electrode functioning as a first electrode plate, a circuit board functioning as a second electrode plate, and a short-circuit section that electrically connects the antenna electrode and the circuit board. The circuit board includes a surface functioning as a first surface opposed to the antenna electrode, a grounding section, a circuit component functioning as a conductive structure disposed on the surface, and a wiring pattern that connects the circuit component and the grounding section.

There is provided a coil component including a coil portion that has at least one layer of planar coil including a coil-wound portion and an insulative layer which covers the periphery of the coil-wound portion, a covering portion that covers the coil portion and is constituted of a mixture including magnetic fillers and resin, and a conductor post that is penetratingly provided inside the covering portion and extends from the coil-wound portion to an upper surface of the covering portion along an axial direction of the planar coil. The conductor post has a post portion which extends from the coil-wound portion in the axial direction of the planar coil, and a lid portion which is exposed from the covering portion and extends from an end portion of the post portion on the upper surface side along a surface direction of the upper surface.

Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

A flexible printed circuit board according to the present disclosures includes a base film having an insulating property and a planar coil disposed on a surface of the base film, wherein a number of turns on an outside of a center point of a coil width of the planar coil in a plan view is greater than a number of turns on an inside of the center point.

A coil device includes a board, a first pattern formed on one surface of the board, and a second pattern formed on the other surface of the board. At least one pattern via electrically connects the first pattern and the second pattern to each other. A via region, corresponding to a region in which the pattern via is formed in the first pattern, includes n first conducting wires (where n is a natural number of 1 or more). At least a portion of the first pattern, excluding the via region in the first pattern, includes m first conducting wires (where m is greater than n and is a natural number of 2 or more).

An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator is made of a material containing resin. The insulator includes a first insulating layer that has a first bonding surface perpendicular to one axial direction and a second insulating layer bonded to the first bonding surface. The internal conductor includes a plurality of first via conductive members provided in the first insulating layer and a plurality of second via conductive members provided in the second insulating layer. Each of the first via conductive members has a first contact connected to the corresponding second via conductive member at a position offset in the one axial direction with respect to the first bonding surface.

When a conductive layer occupying a large area is provided in a coiled antenna portion, it has been difficult to supply power stably. A memory circuit portion and a coiled antenna portion are disposed by being stacked together; therefore, it is possible to prevent a current from flowing through a conductive layer occupying a large area included in the memory circuit portion, and thus, power saving can be achieved. In addition, the memory circuit portion and the coiled antenna portion are disposed by being stacked together, and thus, it is possible to use a space efficiently. Therefore, downsizing can be realized.