An insulated wire, containing: a rectangular conductor; and a thermoplastic resin layer on the rectangular conductor, wherein an adhesion strength between the thermoplastic resin layer and the rectangular conductor for a pair of sides of the rectangular conductor opposed to and an adhesion strength between the thermoplastic resin layer and the rectangular conductor for the other pair of sides of the rectangular conductor opposed to are different from each other.

An insulated wire, containing: a rectangular conductor; and a thermoplastic resin layer on the rectangular conductor, wherein an adhesion strength between the thermoplastic resin layer and the rectangular conductor for a pair of sides of the rectangular conductor opposed to and an adhesion strength between the thermoplastic resin layer and the rectangular conductor for the other pair of sides of the rectangular conductor opposed to are different from each other.

Disclosed herein is a wire that includes: a core wire made of a conductor; an insulating film covering an outer periphery of the core wire; a catalyst adsorption film covering an outer periphery of the insulating film, the catalyst adsorption film including a catalyst serving as a reaction start point of electroless plating; and an outer periphery conductor covering an outer periphery of the catalyst adsorption film.

An insulated electric wire includes a rectangular conductor and an insulation film disposed on the periphery of the rectangular conductor. The insulation film is characterized by: the provision of a resin containing an imide structure within a molecule; and a peak value of less than 1.0 for the loss tangent tan δ, which is represented by the ratio between the loss elastic modulus and the storage elastic modulus, as measured in the 50 DEG C. to 400 DEG C. range.

An insulated electric wire includes a rectangular conductor and an insulation film disposed on the periphery of the rectangular conductor. The insulation film is characterized by: the provision of a resin containing an imide structure within a molecule; and a peak value of less than 1.0 for the loss tangent tan δ, which is represented by the ratio between the loss elastic modulus and the storage elastic modulus, as measured in the 50 DEG C. to 400 DEG C. range.

Individual coils as well as two or more coils arranged one over the other or one coil in combination with a sensor, which can be integrated into planar semiconductor technology are described. A coil comprises a turn and two supply lines for supplying current to the coil. The turn and the supply lines are formed from a metal layer. One of the two supply lines is connected to a first end of the turn and the other of the two supply lines is connected to a second end of the turn.

Individual coils as well as two or more coils arranged one over the other or one coil in combination with a sensor, which can be integrated into planar semiconductor technology are described. A coil comprises a turn and two supply lines for supplying current to the coil. The turn and the supply lines are formed from a metal layer. One of the two supply lines is connected to a first end of the turn and the other of the two supply lines is connected to a second end of the turn.

A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.

A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.

A coil component including a wire has a central conductor and an insulating coating layer, and a terminal electrode has a connection part that is electrically connected to the central conductor. The connection part includes a receiving part that receives an end portion of the wire, and a welding part that extends from the receiving part via a fold-back part so as to face the receiving part. The wire becomes sandwiched between the receiving part and the welding part. The central conductor is welded to the welding part in the portion from which the insulating coating layer is removed. The distal end portion of the wire protrudes from the space between the receiving part and the welding part, with the insulating coating layer remaining on the distal end portion.