A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.