A tantalum capacitor includes a tantalum body having one surface which a tantalum wire extends from, a molded portion including first and second surfaces facing each other in a first direction and third and fourth surfaces facing each other in a second direction, and surrounding the tantalum body, a first lead frame including a first electrode portion in contact with the second surface of the molded portion, a second electrode portion connected to the first electrode portion, a third electrode portion connected to the second electrode portion, and a fourth electrode portion connected to the third electrode portion and the tantalum wire, and a second lead frame disposed to be in contact with the second surface of the molded portion and spaced apart from the first lead frame. The second electrode portion and the third electrode portion are inclined in different directions with respect to the second surface.

A method for fabricating a film on a substrate and a method for controlling the heating rate of a plurality of nanoparticles to transform the plurality of nanoparticles into a plurality of nanorods and nano-cone structures includes the steps of providing a sol precursor, providing a substrate, depositing the sol precursor onto the substrate via a sol-gel technique, annealing the sol precursor under ambient pressure at a controlled heating rate, and cooling down the sol precursor to form a film.

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.

An electrolytic capacitor includes an electrode foil and a lead member connected to the electrode foil. The electrode foil has a first principal surface and a second principal surface opposite to the first principal surface. The electrode foil and the lead member are connected by a caulking part in an overlapping part in which the first principal surface of the electrode foil and the lead member overlap each other. The caulking part has a through-hole penetrating the electrode foil and the lead member. The electrode foil in the caulking part includes a first folded part that is folded back at a peripheral edge portion of the through-hole to be disposed on the second principal surface. The lead member in the caulking part includes (i) a penetrating part that penetrates the electrode foil and (ii) a second folded part that is folded back at an end portion of the penetrating part to be disposed on the second principal surface. The penetrating part includes an inner wall of the through-hole. The second folded part covers the first folded part.

A simple, one-step method for producing a homogenous CeO.sub.2—TiO.sub.2 composite thin film using aerosol-assisted chemical vapor deposition (“CVD”) of a solution containing triacetatocerium (III) and tetra isopropoxytitanium (IV) on a fluorine-doped tin oxide (“FTO”) substrate at a temperature ranging from about 500 to about 650° C. Methods for using the film produced by this method.

A capacitor element and a method for manufacturing the same are provided. The method for manufacturing the capacitor element includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer surroundingly on the oxide layer with the surrounding barrier layer surroundingly formed on an outer surface of the oxide layer; forming a priming layer onto the oxide layer; immersing the priming layer into a chemical synthesis solution for undergoing a chemical synthesis reaction; drying the priming layer so as to form a repaired layer on the priming layer; forming a conductive polymer layer on the repaired layer; and forming a conductive paste layer on the conductive polymer layer with the conductive paste layer including a silver paste layer.

An electrolytic capacitor that includes a capacitor element including an anode portion made of a metal layer, a dielectric layer on an outer surface of the metal layer, and a cathode portion on an outer surface of the dielectric layer; an insulating resin body covering the capacitor element; and a gas barrier film on an outer surface of the insulating resin body, the gas barrier film having a water vapor transmittance of 1 g/m.sup.2 per day or less.

An electrolytic capacitor that includes: a resin molded body that includes a stack including at least one capacitor element and a sealing resin sealing a periphery of the stack; a cathode external electrode on the outer surface of the resin molded body and electrically connected to a conductive layer of the at least one capacitor element; and an anode external electrode on the outer surface of the resin molded body and having a first electrode layer in direct contact with a core and a porous portion of a valve-action metal substrate of the at least one capacitor element, wherein, in a normal direction of the outer surface of the resin molded body, a first thickness of a first portion of the first electrode layer on the core is larger than a second thickness of a second portion of the first electrode layer on the porous portion.

A method for manufacturing an electronic component that includes: preparing an electronic component body having an internal electrode, the internal electrode being exposed on an outer surface of the electronic component body; and forming a first electrode layer by injecting fine metal particles to the outer surface of the electronic component body and causing the fine metal particles to collide with the outer surface at a pressure lower than atmospheric pressure.

A control panel for an appliance defines a display direction and includes a console cover defining a display surface and an inner surface, a printed circuit board defining a first surface and a second surface opposite the first surface along the display direction, wherein the first surface of the printed circuit board is positioned against the inner surface of the console cover, a retention bracket mounted over the second surface of the printed circuit board to secure the printed circuit board to the console cover, and a resilient member that extends from the retention bracket toward the printed circuit board and is biased against the second surface of the printed circuit board.