A combination capacitor and strip material arrangement includes a capacitor element, a strip material, and two connecting wires each including an angled rear mounting part fastened to the strip material, a front contact part providing two contact surfaces connected in series at a predetermined angle and attached to one of positive and negative electrodes of the capacitor element and a middle conducting part having angled portion connected to the angled rear mounting part and an inwardly and transversely extended extension portion connected to the front contact part. Thus, the capacitor element is firmly held down by the contact surfaces of the front contact parts of the two connecting wires for packaging, preventing the capacitor element from deviation, displacement or falling, and thus the capacitor yield can be greatly increased.

A method of manufacturing a ceramic electronic component including a main body including a first principal surface and a second principal surface opposite to each other, and a first external electrode and a second external electrode provided on a portion of a surface of the main body, includes providing a plurality of recesses in a first principal surface of a laminated block including a ceramic material and an organic substance by relatively moving the laminated block and a protrusion surface including a protrusion, in a direction along the first principal surface of the laminated block with the protrusion surface being in contact with a first principal surface of the laminated block, obtaining a chip by cutting the laminated block including the recesses, and obtaining the main body by firing the chip.

A capacitor includes a capacitor element, an outer shell member, and a film. The capacitor element includes a first end surface having a first electrode, a second end surface having a second electrode and a side surface extending between the first end surface and the second end surface. The outer shell member is provided on the first end surface and the second end surface and suppresses a permeation of moisture. The film overlaps with the outer shell member and covers the side surface, is lighter in weight per unit area than the outer shell member, and works together with the outer shell member to suppress the permeation of moisture into the capacitor element.

A wound capacitor package structure and a method for manufacturing the same, and a movable device are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a packaging casing, an elastic sealing component and an elastic buffer body. The conductive assembly includes a first conductive pin and a second conductive pin. The packaging casing is configured to accommodate the wound assembly. The elastic sealing component is disposed inside the packaging casing. The elastic sealing component is configured to isolate the wound assembly from an external environment. The elastic buffer body is disposed on a first surface of the elastic sealing component and surrounded by the packaging casing. The elastic buffer body is configured to slow down an impact force caused by an external force on the wound assembly and reduce a thermal shock caused by an external temperature on the wound assembly.

A method of manufacturing an electronic component includes applying a paste at two locations on a board main surface of a board made of alumina and applying a glass paste between the two locations, heating the board, cutting two locations where a fired layer is provided, forming a layer on an outer periphery in a vicinity of a board end surface, forming a plated layer on an outer periphery of the layer, forming a second plated layer on an outer periphery of the plated layer, providing a solder on the board main surface in a vicinity of an electronic element, and providing the electronic element on the board main surface and attaching the electronic element to an interposer board.

A multilayer ceramic electronic component includes a multilayer portion including multiple internal electrode layers and multiple dielectric layers stacked in a first direction, a pair of main surface protective layers located on opposite main surfaces of the multilayer portion in the first direction, a pair of side protective layers located on opposite side surfaces of the multilayer portion and the main surface protective layers in a second direction, and a plate located adjacent to each of opposite ends of each of the main surface protective layers in a third direction, in which L1L2, where L1 is a length of the plate in the third direction, and L2 is a length in the third direction from one end face of the multilayer portion to an end of an internal electrode layer of the internal electrode layers extending from the other end face of the multilayer portion.

A multilayer ceramic electronic device includes an element body in which each of a plurality of internal electrodes and each of a plurality of dielectric layers mainly composed of ceramic are alternately stacked in a first direction, the element body having a pair of end faces to which the plurality of internal electrodes are alternately exposed, the pair of end faces facing each other in a second direction, copper sections being exposed from a surface of the element body, and a pair of external electrodes in contact with the plurality of internal electrodes exposed from the pair of end faces, respectively, and in contact with each of the copper sections, respectively.

A capacitor includes a capacitor element, a bus bar, and an exterior body. The bus bar includes a connection terminal portion, a first extension portion, and a second extension portion. The connection terminal portion includes a connection surface exposed from the exterior body. An opposite surface of the connection terminal portion that is opposed to the connection surface is positioned apart from one surface of the exterior body, the opposite surface facing the one surface. Each of the first extension portion and the second extension portion extends from corresponding one of both ends in a first direction of the connection terminal portion, a part of the each of the first extension portion and the second extension portion extending in a direction intersecting with the connection surface and being embedded in the exterior body. The first extension portion is connected to the electrode inside the exterior body.

A multilayer ceramic capacitor includes a multilayer body including laminated ceramic layers and laminated inner electrode layers, a barrier film on the multilayer body; and outer electrodes on the barrier film at both end surfaces of the multilayer body. The ceramic layers include a perovskite compound represented by the general formula ABO.sub.3, where the A-site is Ba. The barrier film includes Ba and at least one of S or C. The barrier film covers main surfaces and side surfaces, and also covers the end surfaces except for exposed surfaces at which the inner electrode layers are exposed. The outer electrodes are in contact with the inner electrode layers at the exposed surfaces.

In a multilayer ceramic capacitor, in a surface layer region, side margin portions include a first segregate including silicon as a main ingredient and having a longest dimension of about 10 nm or greater and about 50 nm or smaller, and second segregates each including silicon as a main ingredient and having a longest dimension of about 1 m or greater. An additive ingredient including at least one of zirconium, aluminum, titanium, or calcium is included in the surface layer region. A density of the additive ingredient in the surface layer region is higher than a density of the additive ingredient in an inner region.