An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

A wavelength conversion device that includes a plurality of crystal layers adjacent to one another such that crystal-axis orientations thereof are alternately arranged, the plurality of crystal layers each including a first-thickness portion having a first thickness and a second-thickness portion having a second thickness smaller than the first thickness; and an adhesive layer in at least part of a gap between adjacent second-thickness portions of the plurality of crystal layers and with which the plurality of crystal layers are bonded to one another.

A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.

A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.

A multi-layer ceramic electronic component includes: a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces on which end portions of the internal electrodes in a direction of a second axis orthogonal to the first axis are positioned; and first and second side margins that cover the first and second side surfaces, respectively. When the first and second side margins are each divided equally into first and second regions along a plane perpendicular to the direction of the first axis, the first side margin has a larger average thickness in the first region than in the second region, and the second side margin has a larger average thickness in the second region than in the first region.

A miniaturization process of passive electronic components is revealed. The miniaturization process mainly includes the steps of reforming, reacting at high temperature, preparing paste, dipping in the paste, light curing, packaging, heat curing, cutting pins, coating silver paste, heating and drying, and engraving by laser. The miniaturization process makes production of the passive components with thinner, smaller, and lightweight deign easier and the more convenient. The service life of the passive components is also extended and applications of the passive components are broader.

A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first side surface facing in a direction of a first axis, a second side surface facing in a direction of a second axis orthogonal to the first axis, a ridge that connects the first side surface and the second side surface to each other, and internal electrodes laminated along a third axis orthogonal to the first axis and the second axis and led out in a lead-out region. The external electrode includes a protrusion provided at a position along the ridge and protruding in the directions of the first axis and the second axis, and a first base portion and a second base portion extending from the protrusion along the first side surface and the second side surface, respectively, the external electrode covering the lead-out region.

A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

A ceramic electronic component includes a multilayer chip having a rectangular parallelepiped shape and including dielectric layers and internal electrode layers alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other, and external electrodes respectively formed on the two edge faces, wherein an average crystal grain size of the ceramic in a cross section is 200 nm or less in a dielectric portion, and a CV value of a grain size distribution of crystal grains of the ceramic in the cross section is less than 38% in the dielectric portion, the dielectric portion being defined as a region made of the ceramic in the multilayer chip that is in contact with one of the external electrodes and that has a width of 5 μm from said one of the external electrodes.

A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.