A ceramic electronic device includes: a ceramic main body having a parallelepiped shape in which edges of first internal electrode layers are led out to a first edge face and edges of second internal electrode layer are led out to a second edge face facing the first edge face; and external electrodes respectively formed on the first edge face and the second edge face and extending to at least one side face of the ceramic main body, wherein a distance in a length direction between first conductive layers of the respective external electrodes on the at least one side face is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one side face.

A capacitor may include a stack assembly. The stack assembly may include a plurality of anode plate members, each having an embedded wire. The anode plate members may be separated by at least one cathode foil sandwiched between separator sheets. A conducting member may electrically connect the embedded wires and may have an externally accessible end portion that is hermetically sealed from the interior of the capacitor. A case covers the stack assembly and may be attached to a cover. The case and cover may enclose the stack assembly within an interior area of the capacitor. The at least one cathode foil may be connected to the case. An electrolyte fluid may be disposed within the interior area of the capacitor. A passage may be provided through a central portion of the stack assembly. A tube, surrounded by insulation, may pass through the passage and may be connected to the cover and the case.

A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.

An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.

A winder includes a winding mechanism, a chamber housing the winding mechanism, at least one vacuum pump, and a product case. The winding mechanism is configured to wind a belt-shaped raw film around a winding core. The belt-shaped raw film is composed of a plurality of electrodes and a plurality of separating films. The at least one vacuum pump is configured to suck air into the chamber. The product case is configured to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism disposed in the chamber.

A paste coating apparatus includes a first feeder that feeds a first belt, a mounter that joins one end portion of each of a plurality of electronic components to the first belt, a first coater that coats paste on the other end portion of each of the plurality of electronic components mounted on the first belt, a first dryer that dries the paste, a second feeder that feeds a second belt, a transfer device that transfers the plurality of electronic components from the first belt to the second belt, a second coater that coats the paste on the one end portion of each of the plurality of electronic components mounted on the second belt, a second dryer that dries the paste, and a collection device that winds and collects the second belt.

A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

A method for manufacturing a multilayer ceramic electronic component, includes: an operation of forming a conductive paste for internal electrodes on a ceramic green sheet; an operation of forming a ceramic laminate by laminating a plurality of the ceramic green sheets; an operation of forming a ceramic body including a dielectric layer and a plurality of internal electrodes by sintering the ceramic laminate; an operation of trimming at least one surface of the ceramic body; and an operation of forming at least one external electrode on the at least one trimmed surface of the ceramic body.

A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.