Solid state and hybrid circuit protection devices include improved arc-less switching capability and overcurrent protection, improved terminal assemblies and improved thermal management features that reduce or eliminate ignition sources for hazardous environments. The solid state and hybrid circuit protection devices are ignition protected and avoid possible explosions and therefore obviate a need for conventional explosion-proof enclosures to ensure safe operation of an electrical power system in a hazardous location.

The disclosed concept relates to compositions and methods for the manufacture of electrically resistive, thermally conductive electrical switching apparatus. The composition includes a polymer component and a nanofiber component. The thermal conductivity of the nanofiber component is higher than the thermal conductivity of the polymer component such that the electrical switching apparatus which includes the composition of the disclosed concept has improved heat dissipation as compared to an electrical switching apparatus constructed of the polymer component in the absence of the nanofiber component. Further, the disclosed concept relates to methods of lowering the internal temperature of an electrically resistive, thermally conductive electrical switching apparatus by forming the internals of the apparatus, e.g., circuit breakers, and/or the enclosure from the composition of the disclosed concept.

The disclosed concept relates to compositions and methods for the manufacture of electrically resistive, thermally conductive electrical switching apparatus. The composition includes a polymer component and a nanofiber component. The thermal conductivity of the nanofiber component is higher than the thermal conductivity of the polymer component such that the electrical switching apparatus which includes the composition of the disclosed concept has improved heat dissipation as compared to an electrical switching apparatus constructed of the polymer component in the absence of the nanofiber component. Further, the disclosed concept relates to methods of lowering the internal temperature of an electrically resistive, thermally conductive electrical switching apparatus by forming the internals of the apparatus, e.g., circuit breakers, and/or the enclosure from the composition of the disclosed concept.

A fluid flow and cooling system and method are provided. The system has a substantially cylindrical tube shape and is configured to be installed in a circuit breaker for allowing the flow of fluids while dissipating heat from said fluids. The system comprises a plurality of openings on each of front and back surfaces, the openings of the front surface being connected to the openings of the back surface by a plurality of side passages. By having a plurality of side passages for the flow of fluids, heat dissipation may be improved compared to previous circuit breakers tubes for dispensing arc quenching fluid. The method cools a fluid flowing in a cooling device having side passages.

Systems, methods, techniques and apparatuses of power switches are disclosed. One exemplary embodiment is a power switch comprising an outer housing; a power electronics board disposed within the housing and including a semiconductor switch structured to selectively conduct a current between a first power terminal and a second power terminal; a first heat sink coupled to the power electronics board; a plurality of thermally conductive connectors; a second heat sink coupled to the plurality of thermally conductive connectors, a control electronics board structured to control the semiconductor switch, the control electronics board being located within an enclosure formed of the second heat sink, the plurality of thermally conductive connectors, and the power electronics board.

Systems, methods, techniques and apparatuses of power switches are disclosed. One exemplary embodiment is a power switch comprising an outer housing; a power electronics board disposed within the housing and including a semiconductor switch structured to selectively conduct a current between a first power terminal and a second power terminal; a first heat sink coupled to the power electronics board; a plurality of thermally conductive connectors; a second heat sink coupled to the plurality of thermally conductive connectors, a control electronics board structured to control the semiconductor switch, the control electronics board being located within an enclosure formed of the second heat sink, the plurality of thermally conductive connectors, and the power electronics board.

A switch assembly is configured to be mounted to a lower cover of the junction box assembly. The switch assembly includes a holder, the holder is configured to removably coupled to the lower cover. The holder includes a pocket. The switch assembly further includes a switch. The hook is configured to engage the lower cover and is dimensioned to be seated within the pocket of the holder. The switch includes a hook. The hook is configured to pull the switch towards the lower cover so as to pinch the holder between the lower cover and the switch. Accordingly, the hook presses the switch against a bottom surface of the lower cover so as to eliminate a rattle when the switch is held in suspension beneath the lower cover of the junction box assembly.

A switch assembly is configured to be mounted to a lower cover of the junction box assembly. The switch assembly includes a holder, the holder is configured to removably coupled to the lower cover. The holder includes a pocket. The switch assembly further includes a switch. The hook is configured to engage the lower cover and is dimensioned to be seated within the pocket of the holder. The switch includes a hook. The hook is configured to pull the switch towards the lower cover so as to pinch the holder between the lower cover and the switch. Accordingly, the hook presses the switch against a bottom surface of the lower cover so as to eliminate a rattle when the switch is held in suspension beneath the lower cover of the junction box assembly.

A multi-port power converter including a housing comprising a plurality of ports structured to electrically interface to a plurality of loads, the plurality of loads having distinct electrical characteristics; a plurality of solid-state components configured to provide selected electrical power outputs and to accept selected electrical power inputs; a plurality of solid-state switches configured to provide selected connectivity between the plurality of solid-state components and the plurality of ports; and a controller, the controller comprising: a component bank configuration circuit structured to interpret a port electrical interface description comprising application requirements for a selected mobile electric application, the port electrical interface description comprising a description of at least a portion of the distinct electrical characteristics; and a component bank implementation circuit structured to provide solid switch states in response to the port electrical interface description, and wherein the plurality of solid-state switches are responsive to the solid switch states.

A first busbar includes a first electrical connection portion that is electrically connected to a main relay, a first heat transfer connection portion that is thermally connected to the insulating plate, and a first detour portion that connects the first electrical connection portion and the first heat transfer connection portion to each other. A second busbar includes a second electrical connection portion that is electrically connected to the main relay , a second heat transfer connection portion that is thermally connected to the insulating plate, and a lateral detour portion and a lower detour portion that connect the second electrical connection portion and the second heat transfer connection portion to each other.