H01H2037/008

Device and method for manufacturing device

A device comprising a gate pad, a source pad and a passive actuator arranged to form a reversible mechanical and electrical connection between the gate pad and the source pad only if the temperature in the passive actuator exceeds a threshold value.

Modules, systems, and methods for monitoring environmental conditions
10302455 · 2019-05-28 · ·

Modules, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices that include a sensing device and electronic circuitry for processing an output of the sensing device and generating a output of the module. The sensing device includes a microstructure, for example, a cantilevered beam, and at least one set of contacts configured for contact-mode operation with the microstructure in response to the microstructure deflecting toward or away from the contacts when exposed to the parameter of interest. The microstructure has a stack of layers of dissimilar materials, at least one of which has at least one property that changes as a result of curing of or absorption by the first material when exposed to the parameter.

PACKAGE INTEGRATED SECURITY FEATURES

Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

Zero Power Plasmonic Microelectromechanical Device
20190006136 · 2019-01-03 ·

A zero-power plasmonic microelectromechanical system (MEMS) device is capable of specifically sensing electromagnetic radiation and performing signal processing operations. Such devices are highly sensitive relays that consume no more than 10 nW of power, utilizing the energy in detected electromagnetic radiation to detect and discriminate a target without the need of any additional power source. The devices can continuously monitor an environment and wake up an electronic circuit upon detection of a specific trigger signature of electromagnetic radiation, such as vehicular exhaust, gunfire, an explosion, a fire, a human or animal, and a variety of sources of radiation from the ultraviolet to visible light, to infrared, to terahertz radiation.

Package integrated security features

Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

Integrated electrical-switching mechanical device having a blocked state

An integrated circuit, comprising an electrical-switching mechanical device in a housing having at least one first thermally deformable assembly including a beam held in at least two different locations by at least two arms secured to edges of the housing, the beam and the arms being metallic and situated within the same first metallization level and an electrically conductive body, wherein the said first thermally deformable assembly has at least one first configuration at a first temperature and a second configuration when at least one is at a second temperature different from the first temperature, wherein the beam is at a distance from the body in the first configuration and in contact with the said body and immobilized by the said body in the second configuration and establishing or prohibiting an electrical link passing through the body and through the beam.

MECHANICAL HEAT SWITCH AND METHOD

A first structure has alternating fingers of first and second materials, the first material having a higher thermal conductivity than the second material, a second structure has alternating fingers of third and fourth materials, positioned to selectively contact the first structure, and an actuator connected to move the second structure. A method of manufacturing a heat switch includes forming a first structure in a first material having finger separated from each other by gaps, forming a second structure in the first material having fingers at least partially separated from each other by gaps, positioning the first and second structure adjacent to and in contact with each other, and connecting the second structure to an actuator. A method of operating includes receiving an activation signal at an actuator, and using the actuator to move one structure relative to another structure to change alignment between two regions of different thermal conductivity.

PACKAGE INTEGRATED SECURITY FEATURES

Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

MODULES, SYSTEMS, AND METHODS FOR MONITORING ENVIRONMENTAL CONDITIONS
20170102249 · 2017-04-13 · ·

Modules, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices that include a sensing device and electronic circuitry for processing an output of the sensing device and generating a output of the module. The sensing device includes a microstructure, for example, a cantilevered beam, and at least one set of contacts configured for contact-mode operation with the microstructure in response to the microstructure deflecting toward or away from the contacts when exposed to the parameter of interest. The microstructure has a stack of layers of dissimilar materials, at least one of which has at least one property that changes as a result of curing of or absorption by the first material when exposed to the parameter.