A power distribution device has a resin part covering a portion of a power line and a portion of a signal line and having a switch adjacent to one surface of the resin part, and a cooling part disposed adjacent to a back surface of the resin part opposite to the one surface. The power line and the signal line each have, inside the resin part, a laid-out portion extending in a planar direction orthogonal to an arrangement direction in which the one surface and the back surface are arranged, and a led-out portion extending from the laid-out portion toward the one surface. The laid-out portion of the power line and the laid-out portion of the signal line are located in a projection area of the cooling unit projected in the arrangement direction, and are separated from each other and arranged in the arrangement direction.

A contact mechanism of an electromagnetic relay comprises a contact assembly, a movable contact assembly and a driving unit. The contact assembly comprises a bottom plate, an upper case disposed on the bottom plate, and two stationary contact heads disposed on and penetrating the upper case. The movable contact assembly comprises a central axis passing through the contact assembly, a movable contact plate disposed on the top portion of the central axis and configured to contact with or separate from the two stationary contact heads, and a cover element covering the central portion of the central axis. The driving unit is disposed around the lower portion of the central axis and configured to drive the central axis to move back and forth along the axial direction for allowing the movable contact plate to contact with or separate from the two stationary contact heads.

A contact mechanism of an electromagnetic relay comprises a contact assembly, a movable contact assembly and a driving unit. The contact assembly comprises a bottom plate, an upper case disposed on the bottom plate, and two stationary contact heads disposed on and penetrating the upper case. The movable contact assembly comprises a central axis passing through the contact assembly, a movable contact plate disposed on the top portion of the central axis and configured to contact with or separate from the two stationary contact heads, and a cover element covering the central portion of the central axis. The driving unit is disposed around the lower portion of the central axis and configured to drive the central axis to move back and forth along the axial direction for allowing the movable contact plate to contact with or separate from the two stationary contact heads.

A multiple relay arrangement having a plurality of relay sockets which are arranged next to each other and a plurality of relays. The relay sockets contain additional plug connections with which the relays are controlled by the system cabling. The system cabling contains a distribution section having cable sections and plug connectors and allows the plurality of relays to be controlled.

A multiple relay arrangement having a plurality of relay sockets which are arranged next to each other and a plurality of relays. The relay sockets contain additional plug connections with which the relays are controlled by the system cabling. The system cabling contains a distribution section having cable sections and plug connectors and allows the plurality of relays to be controlled.

A relay device includes: a first contact and a second contact; a driving mechanism; a first conductor; a second conductor; and a static relay and an electric heating element. The driving mechanism is configured to cause the first contact and the second contact to be close to each other or separated from each other. The first conductor is electrically coupled to the first contact. The second conductor is electrically coupled to the second contact. The static relay and an electric heating element are coupled between the first conductor and the second conductor. The electric heating element is disposed to allow heating of one or both of the first contact and the second contact.

A relay device includes: a first contact and a second contact; a driving mechanism; a first conductor; a second conductor; and a static relay and an electric heating element. The driving mechanism is configured to cause the first contact and the second contact to be close to each other or separated from each other. The first conductor is electrically coupled to the first contact. The second conductor is electrically coupled to the second contact. The static relay and an electric heating element are coupled between the first conductor and the second conductor. The electric heating element is disposed to allow heating of one or both of the first contact and the second contact.

Embodiments of the disclosure provide an encapsulated compressor overload, an encapsulated compressor relay start, an encapsulated head pressure control switch and a wiring diagram for a circuit for air conditioning units which prevent gases from being ignited by means of encapsulating sparking components, use of solid-state switching devices, and/or wiring circuits in such a way that open contacts do not contain enough energy to produce a spark capable of igniting the atmosphere.

Embodiments of the disclosure provide an encapsulated compressor overload, an encapsulated compressor relay start, an encapsulated head pressure control switch and a wiring diagram for a circuit for air conditioning units which prevent gases from being ignited by means of encapsulating sparking components, use of solid-state switching devices, and/or wiring circuits in such a way that open contacts do not contain enough energy to produce a spark capable of igniting the atmosphere.

An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have a different wettability with solder material.