A passive wireless switch circuit and related apparatus are provided. In examples discussed herein, an apparatus includes a smaller number of voltage circuits configured to control a larger number of microelectromechanical systems (MEMS) switches. The voltage circuits passively generate a number of constant voltages based on a number of radio frequency (RF) signals to collectively identify each of the MEMS switches. A decoder circuit decodes the constant voltages to identify a selected MEMS switch and provides a selected constant voltage higher than a defined threshold voltage to close the selected MEMS switch. As such, it may be possible to eliminate active components and/or circuits from the passive wireless switch circuit, thus helping to reduce leakage and power consumption. It may be further possible to reduce conductive traces between the voltage circuits and the MEMS switches, thus helping to reduce routing complexity and footprint of the apparatus.

A micro-electro-mechanical system (MEMS) transfer switch is disclosed. The transfer switch comprises a single-pole, N-throw switch section having N selectable switches. Each selectable switch of the N selectable switches has an input, a control terminal and an output. An electrically conductive line is coupled to each of the selectable switches of the N selectable switches. The transfer switch includes a single-pole, M-throw switch section having M selectable switches coupled to the conductive line, each selectable switch of the M selectable switches having an output, a control terminal and an input. The single-pole, N-throw switch section and the single-pole, M-throw switch section are packaged in a single micro-electro-mechanical system (MEMS) die. The N and M are numbers between two and eight and the N selectable switches and the M selectable switches are different switches.

A micro-electromechanical (MEM) relay and its fabrication process. The MEM relay includes a movable actuator electrode anchored to a substrate with two cantilever beams. Below the actuator electrode, there are three fixed electrodes. These three electrodes are the gate, the input, and the output contacts. The square base of the actuator electrode, and the square gate electrode below it, form an electrostatic parallel-plate actuator. When a voltage is applied between the actuator electrode and the gate electrode, the actuator electrode is pulled-down due to electrostatic attraction closing the relay. When the voltage is removed, the cantilever beams act as springs opening the relay.

An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode, forming a second cantilevered electrode over an electrode and operable to contact the first cantilevered electrode upon an application of a voltage to the electrode, and forming an arm on the first cantilevered electrode with an extending protrusion extending upward from an upper surface of the arm.

The present disclosure generally relates to a MEMS device for reducing ESD. A contacting switch is used to ensure that there is a closed electrical contact between two electrodes even if there is no applied bias voltage.

Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

A microelectromechanical systems (MEMS) switch die having an N number of radio frequency (RF) MEMS switches, each having a anchored beam with a switch contact, a gate, and a terminal contact is disclosed. Also included is a MEMS-based decoder having logic gates comprised of logic MEMS switches that are configured to decode the coded signals to determine which of the N number of RF MEMS switches to open and close, apply a higher level gate voltage to each gate of the RF MEMS switches determined to be closed, wherein the higher gate voltage electrostatically pulls the anchored beam and brings the switch contact into electrical contact with the terminal contact, and apply a lower gate voltage to each gate of the RF MEMS switches to be opened, wherein the lower gate voltage releases the anchored beam and allows the switch contact to break electrical contact with the terminal contact.

A microelectromechanical actuator, comprising: a substrate, having a surface; a conductive beam suspended parallel to the substrate, displaceable along an axis normal to the surface of the substrate; a center electrode on the substrate under the beam; a pair of side electrodes on the substrate configured, when charged, to exert an electrostatic force normal to the surface of the substrate on the beam that repulses the beam from the substrate, and exerts a balanced electrostatic force on the beam in a plane of the surface of the substrate, the center conductive electrode being configured to shield the beam from electrostatic forces induced by the side electrodes from beneath the beam, and the center electrode being configured to have a voltage different from a voltage on the beam, to thereby induce an attractive electrostatic force on the beam.

A micro-electromechanical system (MEMS) device includes a substrate and a beam suspended relative to a surface of the substrate. The substrate includes a buried insulator layer and a cavity. The beam includes a first portion and a second portion that are separated by an isolation joint. The cavity separates the surface of the substrate from the beam.

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.