A switch in a package substrate of a microelectronic package is provided, the switch comprising: an actuator plate; a strike plate; and a connecting element mechanically coupling the actuator plate and the strike plate. The switch is configured to move within a cavity inside the package substrate between an open position and a closed position, a conductive material is coupled to the switch and to a ground via in the package substrate, and the conductive material is configured to move with the switch, such that the switch is conductively coupled to the ground via in the open position and the closed position.

Embodiments may relate to a package substrate that includes a signal line and a ground line. The package substrate may further include a switch communicatively coupled with the ground line. The switch may have an open position where the switch is communicatively decoupled with the signal line, and a closed position where the switch is communicatively coupled with the signal line. Other embodiments may be described or claimed.

Embodiments may relate to a package substrate that includes a signal line and a ground line. The package substrate may further include a switch communicatively coupled with the ground line. The switch may have an open position where the switch is communicatively decoupled with the signal line, and a closed position where the switch is communicatively coupled with the signal line. Other embodiments may be described or claimed.

According to one embodiment, an electrical contact assembly is disclosed. The assembly includes a layer of a conducting metal, a layer of copper adjacent to the layer of conducting metal, and a face layer comprising silver graphite adjacent to the layer of copper.

According to one embodiment, an electrical contact assembly is disclosed. The assembly includes a layer of a conducting metal, a layer of copper adjacent to the layer of conducting metal, and a face layer comprising silver graphite adjacent to the layer of copper.

The present invention is a combination of a shape-memory alloy (SMA) element and a fiber sleeve. The SMA connects at each end to a support element, the support elements being moveable relative to each other. The fiber sleeve comprises an electrically insulating sleeve made of flexible fiber material, and is sized so that the sleeve surrounds at least a portion of the SMA element. When the SMA element is deformed upon heating or cooling, causing the support elements to move relative to each other, the fiber sleeve also deforms and continues to surround the portion of the SMA element, inhibiting the flow of electric current from the SMA element to its surroundings.

The present invention concerns an electric actuator (A, A), comprising a rotor member (6) and an actuating assembly (4) configured to interfere with said rotor member (6), causing it to rotate, characterized in that said rotor member (6) comprises a pair of eccentric reliefs (63) arranged so as to interfere with said actuating assembly (4), and in that said actuating assembly (4) comprises a shape memory wire (2), wherein said actuating assembly (4) is configured to cause the rotation of said rotor member (6) when electric current flows through at least a portion of said shape memory wire (2).

An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode.

An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode.

The present invention provides a relay with a shape memory alloy (SMA) wire driven mechanism. Conventional mechanical relays rely on electromagnetic principle to operate. Hence, magnetic fields of electromagnetic relays often interfere with magnetic fields of other electrical components, thus resulting in the components physically interfering with each other. The present invention utilizes the shape memory characteristics of a SMA wire to achieve the purpose of changing the operation of the relay. Specifically, when a SMA wire is heated, it restores to its original shape or original length. Comparing to conventional mechanical relays, the relay provided by the present invention does not magnetically interfere with other electrical components, and thus is able to function effectively. In addition, because the relay of the present invention does not require iron cores or coils, available space therein is increased and may be used to accommodate control circuits with various functions.