Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependence on the control voltage.

A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependence on the control voltage.

Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependence on the control voltage.

A thermodynamic relay gadget includes a relay oscillator and an on-chip controller. The relay oscillator has a time dependent mass or time dependent frequency that is controllable, by the on-chip controller. The relay gadget is configured to relay thermodynamic information in analog form between an output oscillator of a first energy-based model and an input oscillator of a second energy-based model.

A thermodynamic relay gadget includes a relay oscillator and an on-chip controller. The relay oscillator has a time dependent mass or time dependent frequency that is controllable, by the on-chip controller. The relay gadget is configured to relay thermodynamic information in analog form between an output oscillator of a first energy-based model and an input oscillator of a second energy-based model.

A battery system includes a first electrical interface and safety switch connected to the first electrical interface and including a shape memory alloy element configured to deform from an unactuated configuration to an actuated configuration in response to reaching an activation temperature. A second electrical interface is connected to the safety switch, and the connection between the first electrical interface, the safety switch, and the second electrical interface enables electrical current to flow through a LIB cell. When the shape memory alloy element is the unactuated configuration, the safety switch directly engages the first electrical interface and the second electrical interface and enables electrical current to flow through the LIB cell. When in the actuated configuration, the safety switch disconnects from at least one of the first electrical interface and the second electrical interface and disables electrical current from flowing through the LIB cell.