Patent classifications
H01H85/0013
CHIP-TYPE FUSE
A fuse includes a circuit layer, a thermal resistance layer, a base layer and a top layer. The circuit layer includes a fuse wire and two inner electrodes. The inner electrodes are separately connected to two ends of the fuse wire. The thermal resistance layer is superposed to the circuit layer and has a thermal resistance room and two first conductors. The first conductors are disposed in the thermal resistance layer. Each first conductor is connected to one of the inner electrodes. The base layer is closely superposed to the thermal resistance layer and has two outer electrodes on the base layer, two second conductors in the base layer and a degassing passage in the base layer correspondingly to the thermal resistance room. The second conductor is connected to the outer electrode and the first connector. The top layer is closely superposed to the circuit layer.