The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.

In an electrical switch, in particular an electrical microswitch, has at least one electrical contact designed as a hollow-shape section of a component of an electrically conducting material. In this electrical switch, the occurrence of vibrations with the introduction onto an opposing contact is prevented.

An electrical wiring device includes a traveler conductor with a bracing portion that couples the traveler conductor to a support structure formed in the housing of the device. The bracing portion and the support structure facilitate an interference fit between the bracing portion and the support structure. A flipper conductor of the wiring device is structured to be actuated between a first position and a second position, in order to supply power and cut off power to a load electrically connected to the wiring device. When the flipper conductor moves from the second position to the first position, there is an impact on the traveler conductor. The bracing portion has angled cuts that enable the bracing portion to tilt slightly back and forth upon impact from the flipper conductor. The angled cuts and the thermoplastic material properties of the support structure significantly reduce bouncing of the overall traveler conductor structure.