Embodiments describing a method of forming a multi-layered keycap structure are disclosed herein. The method includes forming a first polymer layer on a second polymer layer, wherein the first polymer layer includes a first color and the second polymer layer includes a second color, and coupling the first polymer layer and second polymer layer to a substrate layer such that the first polymer layer is closer to the substrate than the second polymer layer. The method may further include forming a third polymer layer on the second polymer layer; and etching the multi-layered keycap structure to form an opening having a bottom surface that exposes at least one of the first or second color.

This invention discloses a preparation method for precious metal switching contact components by means of plating masking, plating and etching processes. The plating masking process is performed by using a plating mask ink with or without a photo exposure machine. Plating of precious metals is performed by electroless plating or electro plating methods. Etching is carried out with etching solutions containing weak organic acids, weak inorganic acids or acidic buffering agents. Improvement of the etched surface gloss and prevention of the side etching are realized with the sulfur-contained compounds. The dust- and oil stain-resistances of the switch contacts are improved by increasing the etching depth. The switch contacts made by this invention are featured with the advantages of good reliability, good resistance to dust and oil stain, short contact bounce time, long service life, low cost of raw materials and so on.

A key mechanism including one or more butterfly hinges. Each butterfly hinge may include a double wing design operative to move between a depressed position and non-depressed position. Hinged coupling mechanisms couple respective arms of the wings together. Additionally or alternatively, a key mechanism can include one or more half-butterfly hinges. Each half-butterfly hinge includes a double wing design operative to move between a depressed position and non-depressed position. A hinged coupling mechanism couples one set of corresponding arms of the wings together, while the other set of corresponding arms are not coupled together.

An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.

Systems and methods for forming an electrostatic MEMS switch that is used to hot switch a source of current or voltage. At least one surface of the MEMS switch is treated with an ion milling machine to reduce surface roughness to less than about 10 nm rms.

A key mechanism including one or more butterfly hinges. Each butterfly hinge may include a double wing design operative to move between a depressed position and non-depressed position. Hinged coupling mechanisms couple respective arms of the wings together. Additionally or alternatively, a key mechanism can include one or more half-butterfly hinges. Each half-butterfly hinge includes a double wing design operative to move between a depressed position and non-depressed position. A hinged coupling mechanism couples one set of corresponding arms of the wings together, while the other set of corresponding arms are not coupled together.

A classification device for classifying an input signal which is an aperiodic vibration signal, includes a vibratory network and a support. The vibratory network includes a set of vibratory elements and a set of coupling elements that couple the vibratory elements together and to the support, which supports the network. The input signal is classified to be a trigger signal or to be a signal other than a trigger signal depending upon whether a magnitude related to one of the vibratory elements referred to as triggering element is greater than or less than a threshold value. The magnitude is one of a displacement, a velocity, or an acceleration of the triggering element. The switching device includes a classification device and a switching element operationally connected to the classification device, to change a switching state of the switching element when the magnitude reaches or exceeds the threshold value.

An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.

A key mechanism including one or more butterfly hinges. Each butterfly hinge may include a double wing design operative to move between a depressed position and non-depressed position. Hinged coupling mechanisms couple respective arms of the wings together. Additionally or alternatively, a key mechanism can include one or more half-butterfly hinges. Each half-butterfly hinge includes a double wing design operative to move between a depressed position and non-depressed position. A hinged coupling mechanism couples one set of corresponding arms of the wings together, while the other set of corresponding arms are not coupled together.

An electrical fuse for an integrated circuit (IC). The electrical fuse includes a dielectric material substrate, and at least one line of conducting material located in the dielectric material substrate. Each of the at least one line of conducting material includes a first conductive structure, a second conductive structure, and a fuse element extending horizontally between the first and second conductive structures. The fuse element has a height that is less than the height of the first and second conductive structures.