A manufacturing method for an electron source according to the present disclosure includes steps of: (A) cutting out a chip from a block of an electron emission material, (B) fixing a first end portion of the chip to a distal end of a support needle, and (C) sharpening a second end portion of the chip. The step (A) includes forming first and second grooves which constitute first and second surfaces of the chip in the block by irradiating a surface of the block with an ion beam. The first end portion of the chip includes the first surface and the second surface with the surfaces forming an angle of 10 to 90. The step (B) includes forming a joint between the distal end of the support needle and the first end portion of the chip.

A manufacturing method for an electron source according to the present disclosure includes steps of: (A) cutting out a chip from a block of an electron emission material, (B) fixing a first end portion of the chip to a distal end of a support needle, and (C) sharpening a second end portion of the chip. The step (A) includes forming first and second grooves which constitute first and second surfaces of the chip in the block by irradiating a surface of the block with an ion beam. The first end portion of the chip includes the first surface and the second surface with the surfaces forming an angle of 10 to 90. The step (B) includes forming a joint between the distal end of the support needle and the first end portion of the chip.

Electrode assemblies for plasma reactors include a structure or device for constraining an arc endpoint to a selected area or region on an electrode. In some embodiments, the structure or device may comprise one or more insulating members covering a portion of an electrode. In additional embodiments, the structure or device may provide a magnetic field configured to control a location of an arc endpoint on the electrode. Plasma generating modules, apparatus, and systems include such electrode assemblies. Methods for generating a plasma include covering at least a portion of a surface of an electrode with an electrically insulating member to constrain a location of an arc endpoint on the electrode. Additional methods for generating a plasma include generating a magnetic field to constrain a location of an arc endpoint on an electrode.

Electrode assemblies for plasma reactors include a structure or device for constraining an arc endpoint to a selected area or region on an electrode. In some embodiments, the structure or device may comprise one or more insulating members covering a portion of an electrode. In additional embodiments, the structure or device may provide a magnetic field configured to control a location of an arc endpoint on the electrode. Plasma generating modules, apparatus, and systems include such electrode assemblies. Methods for generating a plasma include covering at least a portion of a surface of an electrode with an electrically insulating member to constrain a location of an arc endpoint on the electrode. Additional methods for generating a plasma include generating a magnetic field to constrain a location of an arc endpoint on an electrode.

Certain configurations of a stable capacitor are described which comprise electrodes produced from materials comprising a selected coefficient of thermal expansion to enhance stability. The electrodes can be spaced from each other through one of more dielectric layers or portions thereof. In some instances, the electrodes comprise integral materials and do not include any thin films. The capacitors can be used, for example, in feedback circuits, radio frequency generators and other devices used with mass filters and/or mass spectrometry devices.

Certain configurations of a stable capacitor are described which comprise electrodes produced from materials comprising a selected coefficient of thermal expansion to enhance stability. The electrodes can be spaced from each other through one of more dielectric layers or portions thereof. In some instances, the electrodes comprise integral materials and do not include any thin films. The capacitors can be used, for example, in feedback circuits, radio frequency generators and other devices used with mass filters and/or mass spectrometry devices.

Provided are heat radiation sheet and method of manufacturing the same. The heat radiation sheet comprising: a first protective layer; a first adhesive member which is disposed on the first protective layer and has one or more through holes; a support member which is disposed on the first adhesive member and has one or more through holes; a second adhesive member which is disposed on the support member and has one or more through holes; a heat radiation member which is disposed on the second adhesive member and has one or more through holes; and a third adhesive member which is disposed on the heat radiation member and comprises a base portion contacting a first surface of the heat radiation member and protrusions protruding from the base portion and inserted into the through holes of the heat radiation member, the through holes of the second adhesive member, the through holes of the support member and the through holes of the first adhesive member, wherein the protrusions of the third adhesive member are at least partially coupled to the first protective layer.

The invention relates to an optical module comprising a radiator having one or more heat dissipation surfaces, a fan capable of conveying air onto the heat dissipation surface, and a light source supported by the radiator. The principle characteristic of a module according to the invention is the radiator is formed from folded metal sheets, the fan being secured to the radiator by securing means provided in the folded metal sheet.

A method of wireless communications includes adapting to downlink/uplink resource allocations. In particular, the downlink/uplink communications may be adjusted according to time division duplexed (TDD) configurations of serving and neighbor cells.

A method of wireless communications includes adapting to downlink/uplink resource allocations. In particular, the downlink/uplink communications may be adjusted according to time division duplexed (TDD) configurations of serving and neighbor cells.