A system for extending the life of a repeller in an IHC ion source is disclosed. The system includes an IHC ion source wherein the back surface of the repeller has been shaped to reduce the possibility of electrical shorts. The separation distance between the back surface of the repeller and the chamber wall behind the repeller is increased along its outer edge, as compared to the separation distance near the center of the repeller. This separation distance reduces the possibility that deposited material will flake and short the repeller to the chamber wall. Further, in certain embodiments, the separation distance between the back surface of the repeller and the chamber wall near the center of the repeller is unchanged, so as to minimize the flow of gas that exits from the chamber. The back surface of the repeller may be tapered, stepped or arced to achieve these criteria.

The present invention addresses the problem of providing a device with which it is possible to adjust the focal point of an electron beam both toward a shorter focal point and toward a longer focal point after an electronic gun was fitted on a counterpart device. The aforementioned problem can be solved by an electron gun including a photocathode, and an anode, the electron gun furthermore comprising an intermediate electrode disposed between the photocathode and the anode, the intermediate electrode comprising an electron-beam passage hole through which an electron beam released from the photocathode passes, and the electron-beam passage hole having formed therein a drift space in which, when an electrical field is formed between the photocathode and the anode due to application of a voltage, the effect of the electrical field can be disregarded.

The present invention addresses the problem of providing a device with which it is possible to adjust the focal point of an electron beam both toward a shorter focal point and toward a longer focal point after an electronic gun was fitted on a counterpart device. The aforementioned problem can be solved by an electron gun including a photocathode, and an anode, the electron gun furthermore comprising an intermediate electrode disposed between the photocathode and the anode, the intermediate electrode comprising an electron-beam passage hole through which an electron beam released from the photocathode passes, and the electron-beam passage hole having formed therein a drift space in which, when an electrical field is formed between the photocathode and the anode due to application of a voltage, the effect of the electrical field can be disregarded.

An object is to provide an electron beam applicator suitable for an electron gun having a photocathode and an electron beam emission method in the electron beam applicator. The object can be achieved by an electron beam applicator including: an electron gun section; a main body section; and a control unit. The electron gun section includes a light source, a photocathode that emits an electron beam in response to receiving excitation light emitted from the light source, and an anode. The main body section includes an objective lens that converges an electron beam emitted from the electron gun section. The control unit controls at least convergence power of the objective lens in accordance with a size of an electron beam emitted from the photocathode.

An electron gun includes: a cathode, which has a cathode holder and a cathode body; and a Wehnelt cylinder. The cathode holder receives the cathode body and the Wehnelt cylinder is suitable for bundling free electrons, which can escape from the cathode body toward the Wehnelt cylinder, to form an electron beam. The Wehnelt cylinder is interlockingly arranged, at least in some parts along a first inner surface facing the cathode holder, on an outer surface of the cathode holder and at least partly extends around the cathode holder.

The present invention provides a method for using ion filtering to adjust the number of ions delivered to a substrate. The method comprising a process chamber being provided that is operatively connected to a plasma source. The substrate is provided on a substrate support that is provided within the process chamber. An electrical bias source is provided that is operatively connected to an aperture plate that is provided in the process chamber. The substrate on the substrate support is processed using a plasma generated using the plasma source. A variable bias voltage from the electrical bias source is applied to the aperture plate during the plasma processing of the substrate. The plasma processing of the substrate can further comprise exposing the substrate to a plasma time division multiplex process which alternates between deposition and etching on the substrate.

The present invention provides a method for using ion filtering to adjust the number of ions delivered to a substrate. The method comprising a process chamber being provided that is operatively connected to a plasma source. The substrate is provided on a substrate support that is provided within the process chamber. An electrical bias source is provided that is operatively connected to an aperture plate that is provided in the process chamber. The substrate on the substrate support is processed using a plasma generated using the plasma source. A variable bias voltage from the electrical bias source is applied to the aperture plate during the plasma processing of the substrate. The plasma processing of the substrate can further comprise exposing the substrate to a plasma time division multiplex process which alternates between deposition and etching on the substrate.

A device includes an electro-mechanical switching device having an open-circuit and closed-circuit conditions and a path of least resistance having a path input and a path output with the switching device between the input and the output. The device includes a bypass power switch device that comprises a solid-state circuit interrupter and that is configured to conduct current between the input and the output in response to an open-circuit condition of the switching device. The device includes a current sensor that is connected to the output and configured to detect a fault current event. The device includes an actuator that is coupled to the switching device and a controller that is configured to generate a trigger signal to activate the actuator to cause the open-circuit condition of the switching device and to interrupt the fault current event by the power switch device, based on the detected fault current event.

A device includes an electro-mechanical switching device having an open-circuit and closed-circuit conditions and a path of least resistance having a path input and a path output with the switching device between the input and the output. The device includes a bypass power switch device that comprises a solid-state circuit interrupter and that is configured to conduct current between the input and the output in response to an open-circuit condition of the switching device. The device includes a current sensor that is connected to the output and configured to detect a fault current event. The device includes an actuator that is coupled to the switching device and a controller that is configured to generate a trigger signal to activate the actuator to cause the open-circuit condition of the switching device and to interrupt the fault current event by the power switch device, based on the detected fault current event.

A device includes an electro-mechanical switching device having an open-circuit and closed-circuit conditions and a path of least resistance having a path input and a path output with the switching device between the input and the output. The device includes a bypass power switch device that comprises a solid-state circuit interrupter and that is configured to conduct current between the input and the output in response to an open-circuit condition of the switching device. The device includes a current sensor that is connected to the output and configured to detect a fault current event. The device includes an actuator that is coupled to the switching device and a controller that is configured to generate a trigger signal to activate the actuator to cause the open-circuit condition of the switching device and to interrupt the fault current event by the power switch device, based on the detected fault current event.