A lighting circuit includes a controllable electronic device in series with a power terminal of a controller, wherein operation of a switch causes the controller to maintain the electronic device conductive, whereby the controller then remains powered; and wherein the controller responds to a subsequent operation of the switch to render the electronic device nonconductive, whereby the controller is then unpowered even when electrical power is received. The lighting circuit is suitable for use, e.g., in a portable or other battery powered light.

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

An LED tube lamp includes a glass tube, two end caps, a power supply, and an LED light strip. The glass tube includes a main body region, two rear end regions, and two transition regions connecting the main body region and the rear end regions. The end cap is disposed at one end of the glass tube and the power supply is provided inside the end cap. The LED light strip is disposed inside the glass tube and has LED light sources disposed thereon. The LED light strip includes a bendable circuit sheet mounted on inner surface of the glass tube. The bendable circuit sheet of the LED light strip is formed with a freely extending end portion at one end, and the freely extending end portion is electrically connected to the power supply. The glass tube and the end cap are secured by a hot melt adhesive.

In various embodiments, a light-emitting apparatus is disclosed. In one example, the light-emitting apparatus comprises a substrate, an LED string mounted on the substrate, in which LED string a plurality of LEDs are connected in series, a power supply path connected in series to the LED string, and a plurality of protection elements, each protection element having a first node commonly connected to the power supply path and a second node connected between a pair of the LEDs in the series, wherein the protection elements include capacitors or zener diodes, and an AC impedance of each protection element is smaller than an impedance between the pair of LEDs and a case ground.

A metamaterial high-power microwave source relates to the fields of vacuum electronic technology, particle physics, and accelerators, including: a cathode, a metamaterial slow-wave structure (SWS), a waveguide and coaxial line coupler located at one end of the metamaterial SWS and a collector component located at the other end of the metamaterial SWS. The metamaterial SWS provided by the present invention is greatly smaller than a rectangular waveguide having the same frequency, so as to realize a miniaturization of devices and facilitate integration with semiconductor devices. The waveguide and coaxial line coupler has a good transmission characteristic and a low reflection in a relatively wide frequency band, which guarantees a high-efficient coupling output of a signal. Moreover, the metamaterial high-power microwave source has a high-power output and a pulsed output power reaching a megawatt level.

A metamaterial high-power microwave source relates to the fields of vacuum electronic technology, particle physics, and accelerators, including: a cathode, a metamaterial slow-wave structure (SWS), a waveguide and coaxial line coupler located at one end of the metamaterial SWS and a collector component located at the other end of the metamaterial SWS. The metamaterial SWS provided by the present invention is greatly smaller than a rectangular waveguide having the same frequency, so as to realize a miniaturization of devices and facilitate integration with semiconductor devices. The waveguide and coaxial line coupler has a good transmission characteristic and a low reflection in a relatively wide frequency band, which guarantees a high-efficient coupling output of a signal. Moreover, the metamaterial high-power microwave source has a high-power output and a pulsed output power reaching a megawatt level.

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Electroplated helical conductors and methods for making the electroplated helical conductors are provided. The electroplated helical conductors are made from pre-formed thermally and electrically conducting nanomembrane ribbons having non-helical or helical configurations. The dimensions and shapes of the pre-formed nanomembrane ribbons are altered and controlled by the electrodeposition of a metal film onto the surfaces of the nanomembrane ribbons.

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.