Patent classifications
H01J27/02
AEROSOL IONIZER
A system and method comprising an ion production chamber having an ultra-violet light source disposed towards said chamber, a coated quartz plate between the chamber and the UV source whose coating absorbs incident UV light and ejects electrons into the chamber through the photoelectric effect, a harvest gas disposed to flow through the chamber from an inlet to an outlet, and a jet operable to introduce a sample into the harvest gas flow. In some embodiments the system includes using helium as the harvest gas. Certain embodiments include introducing a sample perpendicular to the harvest gas flow and using multiple sample introduction jets to increase mixing efficiency. In some embodiments the harvest gas and particle sample jet are one and the same. The charge sample may be coupled to a MEMS-based electrometer.
GAS INLET FOR AN ION THRUSTER
A gas inlet suitable in particular for use in an ion thruster includes a housing which is made of a gas-tight ceramics material, and an insert which is arranged in the housing and is made of a porous ceramics material. The geometry and pore structure of the insert are such that the insert forms a desired flow resistance for a gas stream flowing through the insert.
Hydrogen COGas for carbon implant
A system, apparatus and method for increasing ion source lifetime in an ion implanter are provided. Oxidation of the ion source and ion source chamber poisoning resulting from a carbon and oxygen-containing source gas is controlled by utilizing a hydrogen co-gas, which reacts with free oxygen atoms to form hydroxide and water.
CESIUM PRIMARY ION SOURCE FOR SECONDARY ION MASS SPECTROMETER
A primary ion source subassembly for use with a secondary ion mass spectrometer may include a unitary graphite ionizer tube and reservoir base. A primary ion source may include a capillary insert defining an ionizer aperture. An ionizer aperture may be centrally arranged in an outwardly protruding conical or frustoconical surface, and may be overlaid with a refractory metal coating or sheath. Parameters including ionizer surface shape, ionizer materials, ionizer temperature, and beam stop plate orifice geometry may be manipulated to eliminate ghost images. A graphite tube gasket with a dual tapered surface may promote sealing of a source material cavity.
High power wafer cooling
A gas generation system for an ion implantation system has a hydrogen generator configured to generate hydrogen gas within an enclosure. A chuck, such as an electrostatic chuck, supports a workpiece in an end station of the ion implantation system, and a delivery system provides the hydrogen gas to the chuck. The hydrogen gas can be provided through the chuck to a backside of the workpiece. Sensors can detect a presence of the hydrogen gas within the enclosure. A controller can control the hydrogen generator. An exhaust system can pass air through the enclosure to prevent a build-up of the hydrogen gas within the enclosure. A purge gas system provides a dilutant gas to the enclosure. An interlock system can control the hydrogen generator, delivery system, purge gas system, and exhaust system to mitigate hydrogen release based on a signal from the one or more sensors.
High power wafer cooling
A gas generation system for an ion implantation system has a hydrogen generator configured to generate hydrogen gas within an enclosure. A chuck, such as an electrostatic chuck, supports a workpiece in an end station of the ion implantation system, and a delivery system provides the hydrogen gas to the chuck. The hydrogen gas can be provided through the chuck to a backside of the workpiece. Sensors can detect a presence of the hydrogen gas within the enclosure. A controller can control the hydrogen generator. An exhaust system can pass air through the enclosure to prevent a build-up of the hydrogen gas within the enclosure. A purge gas system provides a dilutant gas to the enclosure. An interlock system can control the hydrogen generator, delivery system, purge gas system, and exhaust system to mitigate hydrogen release based on a signal from the one or more sensors.
CHARGED PARTICLE BEAM SYSTEM
An ion source includes an external housing, an electrically conductive tip, a gas supply system, configured to supply an operating gas into the neighborhood of the tip, and a cooling system configured to cool the tip. The gas supply system includes a first tube with a hollow interior, and a chemical getter material is provided in the hollow interior of the tube.
Process gas enhancement for beam treatment of a substrate
A beam processing system and method of operating are described. In particular, the beam processing system includes a beam source having a nozzle assembly that is configured to introduce a primary gas through the nozzle assembly to a vacuum vessel in order to produce a gaseous beam, such as a gas cluster beam, and optionally, an ionizer positioned downstream from the nozzle assembly, and configured to ionize the gaseous beam to produce an ionized gaseous beam. The beam processing system further includes a process chamber within which a substrate is positioned for treatment by the gaseous beam, and a secondary gas source, wherein the secondary gas source includes a secondary gas supply system that delivers a secondary gas, and a secondary gas controller that operatively controls the flow of the secondary gas injected into the beam processing system downstream of the nozzle assembly.
PARTICLE CHARGER
A particle charger is provided with: a filter (28) partitioning the inside of a housing (20) into a first space (29) and second space (30); a particle introducer (22) for introducing a particle into the first space; a gas ion supplier (10) for supplying the first space with a gas ion; a potential gradient creator (26, 27, 31) for creating a potential difference within the housing so as to make the gas ion and a charged particle resulting from a contact of the aforementioned particle with the gas ion move toward the second space; an AC voltage supplier (32, 33) for applying AC voltages having a phase difference to the neighboring electrodes (28a, b) included in the filter; a controller (35) for performing a control for applying, to the plurality of electrodes, predetermined voltages so as to allow the charged particle to pass through a gap between the electrodes while trapping the gas ion by the electrodes; and a charged particle extractor (23, 25, 34) for extracting the charged particle admitted to the second space to the outside of the housing. By this configuration, the occurrence frequency of the multi-charging is suppressed.
SYSTEM AND METHOD FOR POWER CONVERSION
A polarity-selectable high voltage direct current power supply including a first drive assembly that transforms a first low voltage DC input into a first medium voltage alternating current output; a first HV output assembly that transforms the first LV AC output into a first HV DC output, wherein the first HV output assembly defines a first input stage; a polarity selector coupled between the second output junction of the first drive assembly and the first and second input stages of the first HV output assembly, the polarity selector operable between a first configuration and a second configuration; wherein in the first configuration the first HV DC output has a positive polarity; and wherein in the second configuration the first HV DC output has a negative polarity.