A detecting method and a detecting equipment therefor are provided. The detecting method includes: inspecting whether a display panel has a defective position; after acquiring the defective position of the display panel by the inspecting, using a first focused ion beam generated by a first ion overhaul apparatus to cut the defective position of the display panel, so as to strip a defect at the defective position and observe morphology of defect; using a repair apparatus to perform a repair treatment on the defective position after the defect is stripped. An inspection apparatus for the inspecting of the defective position, the first ion overhaul apparatus and the repair apparatus are sequentially installed on the same production line.

Wires for use in electron beam or plasma arc additive manufacturing of titanium alloys are disclosed. The wires have a first portion comprising a first material, and a second portion comprising a second material. The combination of the first and second materials results in a titanium alloy product of the appropriate composition.

Wires for use in electron beam or plasma arc additive manufacturing of titanium alloys are disclosed. The wires have a first portion comprising a first material, and a second portion comprising a second material. The combination of the first and second materials results in a titanium alloy product of the appropriate composition.

Disclosed herein is a composite charged particle beam apparatus including a focused ion beam column and an electron beam column, the apparatus preventing the electron beam column from being contaminated so as to emit an electron beam with high precision. The apparatus includes: a sample tray on which a sample is placed; a focused ion beam column irradiating the sample by using a focused ion beam; an electron beam column irradiating the sample by using an electron beam; a sample chamber receiving the sample tray, and the columns therein; an anti-contamination plate moving between an inserted position inserted into a space between a beam emission surface of the electron beam column and the sample tray, and an open position withdrawn from the space between the beam emission surface and the sample tray; and an operation unit operating the anti-contamination plate to move between the positions.

An angle measurement device includes: a slit through which an ion beam is incident, and a width direction of which is orthogonal to a beam traveling direction of the ion beam toward a wafer; and a plurality of electrode bodies which are provided at positions away from the slit in the beam traveling direction, and each of which includes a beam measurement surface that is a region which is exposed to the ion beam having passed through the slit. The plurality of electrode bodies are disposed such that the beam measurement surfaces of the electrode bodies are arranged in order in the width direction of the slit and the beam measurement surfaces adjacent to each other in the width direction of the slit deviate from each other in the beam traveling direction.

A sanitizer for sanitizing various surfaces including hands, hardware, fixtures, appliances, countertops, equipment, utensils and more and more specifically to a chemical-free sanitizer, more specifically to an ozone-free sanitizer and yet more specifically to an electronic sanitizer and yet more specifically to an ion source sanitizer.

The present invention relates to modulating an irradiation condition of a charged particle beam at high speed and detecting a signal in synchronization with a modulation period for the purpose of extracting a signal arising from a certain charged particle beam when a sample is irradiated with a plurality of charged particle beams simultaneously or, for example, for the purpose of separating a secondary electron signal arising from ion beam irradiation and a secondary electron signal arising from electron beam irradiation in an FIB-SEM system. The present invention further relates to dispersing light emitted from two or more kinds of scintillators having different light emitting properties, detecting each signal strength, and processing a signal on the basis of a ratio of first signal strength when the sample is irradiated with a first charged particle beam alone to second signal strength when the sample is irradiated with a second charged particle beam alone, the ratio being set by a mechanism. The present invention enables extraction of only a signal arising from a desired charged particle beam even when the sample is irradiated with the plurality of charged particle beams simultaneously. The SEM observation can be performed in the middle of the FIB processing using the secondary electron in the FIB-SEM system, for example.

The present invention relates to modulating an irradiation condition of a charged particle beam at high speed and detecting a signal in synchronization with a modulation period for the purpose of extracting a signal arising from a certain charged particle beam when a sample is irradiated with a plurality of charged particle beams simultaneously or, for example, for the purpose of separating a secondary electron signal arising from ion beam irradiation and a secondary electron signal arising from electron beam irradiation in an FIB-SEM system. The present invention further relates to dispersing light emitted from two or more kinds of scintillators having different light emitting properties, detecting each signal strength, and processing a signal on the basis of a ratio of first signal strength when the sample is irradiated with a first charged particle beam alone to second signal strength when the sample is irradiated with a second charged particle beam alone, the ratio being set by a mechanism. The present invention enables extraction of only a signal arising from a desired charged particle beam even when the sample is irradiated with the plurality of charged particle beams simultaneously. The SEM observation can be performed in the middle of the FIB processing using the secondary electron in the FIB-SEM system, for example.

A method includes applying a first voltage to a source of a first transistor of a detector unit of a semiconductor detector in a test wafer and applying a second voltage to a gate of the first transistor and a drain of a second transistor of the detector unit. The first transistor is coupled to the second transistor in series, and the first voltage is higher than the second voltage. A pre-exposure reading operation is performed to the detector unit. Light of an exposure apparatus is illuminated to a gate of the second transistor after applying the first and second voltages. A post-exposure reading operation is performed to the detector unit. Data of the pre-exposure reading operation is compared with the post-exposure reading operation. An intensity of the light is adjusted based on the compared data of the pre-exposure reading operation and the post-exposure reading operation.

Apparatuses and methods directed toward endpoint detection are disclosed herein. An example method at least includes forming a plurality of lines on a top surface of a sample; removing, a plurality of times, material from a working surface of the sample, the working surface different than the top surface; imaging, a plurality of times, the sample to at least capture the plurality of lines; and determining an endpoint based on a relative spatial characteristic between two or more lines of the plurality of lines.