H01J2237/15

Ultrafast electron diffraction apparatus

There is provided an ultrafast electron diffraction apparatus including: a photoelectron gun configured to emit an electron beam; a bending portion for emitting the electron beam emitted from the photoelectron gun by changing a travel direction of the electron beam by a predetermined angle; and a sample portion including a sample to be analyzed by the electron beam emitted from the bending portion. The electron beam reaches the sample portion in a state that a pulse of the electron beam is compressed and the timing jitter between the pumping light and probe electron pulse is completely reduced as the travel direction of the electron beam is changed by the predetermined angle through the bending portion.

Apparatus and method for measuring energy spectrum of backscattered electrons

The present invention relates to an apparatus and method for analyzing the energy of backscattered electrons generated from a specimen. The apparatus includes: an electron beam source (101) for generating a primary electron beam; an electron optical system (102, 105, 112) configured to direct the primary electron beam to a specimen while focusing and deflecting the primary electron beam; and an energy analyzing system configured to detect an energy spectrum of backscattered electrons emitted from the specimen. The energy analyzing system includes: a Wien filter (108) configured to disperse the backscattered electrons; a detector (107) configured to measure the energy spectrum of the backscattered electrons dispersed by the Wien filter (108); and an operation controller (150) configured to change an intensity of a quadrupole field of the Wien filter (108), while moving a detecting position of the detector (107) for the backscattered electrons in synchronization with the change in the intensity of the quadrupole field.

METHOD OF IMAGING A SAMPLE WITH A CHARGED PARTICLE BEAM DEVICE, METHOD OF CALIBRATING A CHARGED PARTICLE BEAM DEVICE, AND CHARGED PARTICLE BEAM DEVICE

A method of imaging a sample with a charged particle beam device, comprising: determining a first focusing strength of an objective lens of the charged particle beam device, the first focusing strength being adapted to focus a charged particle beam on a first surface region of the sample; determining a first focal subrange of a plurality of focal subranges such that the first focusing strength is within the first focal subrange, wherein the plurality of focal subranges is associated with a set of values of a calibration parameter; determining a first value of the calibration parameter, the first value being associated with the first focal subrange; and imaging the first surface region with the first value.

METHOD OF IMAGING A 2D SAMPLE WITH A MULTI-BEAM PARTICLE MICROSCOPE
20210351001 · 2021-11-11 ·

A fast method of imaging a 2D sample with a multi-beam particle microscope includes the following steps: providing a layer of the 2D sample; determining a feature size of features included in the layer; determining a pixel size based on the determined feature size in the layer; determining a beam pitch size between individual beams in the layer based on the determined pixel size; and imaging the layer of the 2D sample with a setting of the multi-beam particle microscope based on the determined pixel size and based on the determined beam pitch size.

Height measuring device, charged particle beam apparatus, and height measuring method
11754388 · 2023-09-12 · ·

A height measuring device includes a light source that emits light in a direction oblique to a top surface of a specimen, a slit that shapes the light from the light source to form a slit image on the specimen, an imaging element that detects reflected light reflected by the specimen, and an arithmetic unit. The arithmetic unit: identifies a slit image of the reflected light reflected by the top surface of the specimen from among a plurality of slit images based on respective positions of the plurality of slit images on a detection surface of the imaging element; and determines the height of the top surface of the specimen based on the position of the slit image of the reflected light reflected by the top surface of the specimen on the detection surface.

Gas jet deflection in pressurized systems

Provided herein are articles of manufacture, systems, and methods employing a gas-deflector plate in low to ultra-high vacuum systems that use differential pumping (e.g., gas-target particle accelerators, mass spectrometers, and windowless delivery ports). In certain embodiments, the gas-deflector plate is configured to be positioned between higher and lower pressure regions in a pressurized system, wherein the gas-deflector plate has a channel therethrough shaped and/or angled such that jetting gas moving through the channel enters the lower pressure region at an angle offset from the vertical axis of the gas-deflector plate and/or the channel. In other embodiments, a jet-deflector component is employed such that the jetting gas strikes such jet-deflector component and is re-directed in another direction.

INTEGRATED CIRCUIT DIE TEST ARCHITECTURE
20230366920 · 2023-11-16 ·

A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.

INTEGRATED CIRCUIT DIE TEST ARCHITECTURE
20220341985 · 2022-10-27 ·

A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.

Integrated circuit die test architecture
11391769 · 2022-07-19 · ·

A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.

Simultaneous TEM and STEM microscope
11404241 · 2022-08-02 · ·

Methods for using a single electron microscope system for investigating a sample with TEM and STEM techniques include the steps of emitting electrons toward the sample, forming the electrons into a two beams, and then modifying the focal properties of at least one of the two beams such that they have different focal planes. Once the two beams have different focal planes, the first electron beam is focused such that it acts as a STEM beam that is focused at the sample, and the second electron beam is focused so that it acts as a TEM beam that is parallel beam when incident on the sample. Emissions resultant from the STEM beam and the TEM beam being incident on the sample can then be detected by a single detector or detector array and used to generate a TEM image and a STEM image.