Embodiments relate to a grid short clearing system is provided for gridded ion beam sources used in industrial applications for materials processing systems that reduces grid damage during operation. In various embodiments, the ion source is coupled to a process chamber and a grid short clearing system includes methods for supplying a gas to the process chamber and setting the gas pressure to a predetermined gas pressure in the range between 50 to 750 Torr, applying an electrical potential difference between each adjacent pair of grids using a current-limited power supply, and detecting whether or not the grid shorts are cleared. The electrical potential difference between the grids is at least 10% lower than the DC electrical breakdown voltage between the grids with no contaminants.

Techniques for yield management in semiconductor inspection systems are described. According to one aspect of the present invention, columns of sensing mechanism are configured with different functions, weights and performances to inspect a sample to significantly reduce the time that would be otherwise needed when all the columns were equally applied.

Embodiments disclosed herein include an abatement system for abating compounds produced in semiconductor processes. The abatement system includes an exhaust cooling apparatus located downstream of a plasma source. The exhaust cooling apparatus includes at least one cooling plate a device for introducing turbulence to the exhaust flowing within the exhaust cooling apparatus. The device may be a plurality of fins, a cylinder with a curved top portion, or a diffuser with angled blades. The turbulent flow of the exhaust within the exhaust cooling apparatus causes particles to drop out of the exhaust, minimizing particles forming in equipment downstream of the exhaust cooling apparatus.

In the present invention, a pressure measurement device for determining the vacuum level within the evacuated housing of a vacuum electrode device is provided that includes an electrically conductive enclosure secured to an interior surface of the housing, an electrically conductive electrode extending through an aperture in the housing, the electrode having a tip at one end positioned within the interior of the housing inside the enclosure to define a gap between the tip and the enclosure and a conductive lead at a second end disposed outside of the housing, and a voltage source connected to the conductive lead to supply a voltage potential to the tip of the electrode. A voltage difference produced between the electrode and the enclosure ionizes gas within the enclosure causing a measurable current to flow between the electrode and the enclosure which can be used to determine the vacuum level in the housing.

A welding head for a welding apparatus, the head comprising an outer face attachable to a welding device such as an electron beam gun or laser, an inner face sealable to a workpiece, and an outer sealing ring and an inner sealing ring situated within the inner face and disposed on either side of an evacuatable region, wherein the inner face has a teardrop-shaped profile. Outer and inner sealing rings can be inflatable or formed from different materials, the outer sealing ring being formed from a material with a Shore hardness of between 50 to 70 and the inner sealing ring being formed from a material with a Shore hardness of 20 to 40. A bridging seal can extend from within the inner sealing ring to the outer sealing ring.

Embodiments described herein relate to a heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a heat exchanging surface within the heat exchanger. The heat exchanging surface can be a curved shaped which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller foot print and reducing costs.

An apparatus includes an electrostatic chuck and located within a vacuum enclosure. A plurality of conductive plates can be embedded in the electrostatic chuck, and a plurality of plate bias circuits can be configured to independently electrically bias a respective one of the plurality of conductive plates. Alternatively or additionally, a plurality of spot lamp zones including a respective set of spot lamps can be provided between a bottom portion of the vacuum enclosure and a backside surface of the electrostatic chuck. The plurality of conductive plates and/or the plurality of spot lamp zones can be employed to locally modify chucking force and to provide local temperature control.

The invention relates to an ionization vacuum measuring cell (10) comprising an evacuable housing (12) with a measurement connection for a vacuum to be measured at an end portion; a measurement chamber (14) in the housing (12), said measurement chamber being fluidically connected to the measurement connection, wherein the measurement chamber (14) is designed as a replaceable component; and a first and a second electrode (16, 18) in the measurement chamber (14), said electrodes being substantially coaxial to an axis and being arranged at a distance from each other. The measuring cell further comprises an electrically insulating and vacuum-tight feedthrough (20) for an electric supply to the second electrode (18) and a magnetization assembly which is designed to generate a magnetic field in the ionization chamber. According to the invention, the measurement chamber (14), in particular at least one of the electrodes (16, 18), comprises a magnetic material.

The invention relates to a transport apparatus for transferring a sample between two devices. The transport apparatus comprises a transport tube provided with a carrier for holding a sample. The carrier is movable within said transport tube along a length thereof. The transport apparatus further comprises an actuator tube extending substantially next to said transport tube and which is provided with an actuator element that is movable within said actuator tube. Said actuator element comprises a first magnet part, and said sample carrier is provided with a second magnet part, wherein said first magnet part and said second magnet part are configured such that movement of the sample carrier through said transport tube is linked to movement of the magnetic actuator element through the actuator tube. In this way, movement of the magnetic actuator causes movement of the sample carrier, allowing safe, reliable and protected transport of the sample.

A substrate processing apparatus includes a chamber, a supply pipe, a discharge pipe, a trap section, a heater, a buffer section, and a cooling pipe. The chamber houses a substrate. The supply pipe supplies a processing gas into the chamber. The discharge pipe discharges a gas produced in the chamber. The trap section is disposed in the discharge pipe. The heater heats the trap section. The buffer section is disposed downstream of the trap section in the discharge pipe. The cooling pipe cools the buffer section.